Mechanical Engineer

RANOVUS Inc.; Ottawa; On-site; CAD 70,000 - 100,000; Full time

Job summary

Une entreprise innovante à Ottawa recherche un Ingénieur Mécanique pour rejoindre son équipe. Vous serez responsable de l'intégration de composants photoniques et ASIC dans des processus de fabrication destinés aux centres de données, et d'améliorer les processus d'assemblage pour maximiser l'efficacité. Un environnement dynamique et orienté vers l'innovation vous attend, accompagné d'excellentes opportunités de développement.

Qualifications

• Expérience de 5+ ans dans un poste similaire.
• Compréhension des outils Lean Six Sigma et capacité à les intégrer.
• Compétences techniques solides en expérimentation scientifique et résolutions de problèmes.

Responsibilities

• Conception et développement de sous-assemblages complexes et de composants.
• Participation à l'élaboration de spécifications de produit et de concepts système.
• Développement de manuels d'opérations et d'entretiens.

Skills

Problem Solving

Teamwork

Communication

Lean Six Sigma

Education

Master’s/PhD in Mechanical Engineering

Tools

SolidWorks

Job description

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity. RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures. We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation. Working with world class fabrication partners, RANOVUS is the leader in the application of unique new technologies to fiber-optic communications products for data-centers.

We are seeking a Mechanical Engineer to join our team.

As a successful candidate, you will be working as the Photonic/ASIC Components integrator, working with Photonics, High Speed ASIC, Laser design teams and Ranovus’ CMs to define best in class optimal assembly processes for high volume Optical Engine (Module) manufacturing, targeted for data center applications. In conjunction with the project team, your role will be to support the micro-assembly process development (and manufacturing work instructions) during all phases of the project development (i.e. During NPI & Production Phase). Specifically, you will work on improvement and optimization of Silicon integrated photonic devices manufacturing & assembly processes.

Responsibilities Generally Include

• Design and develops complex sub-assemblies, components, and packaging as assigned.
• Develops and implements changes to product design and/or the manufacturing process to achieve efficiency, quality, and/or cost improvements by participating in new product development programs.
• Develops requirement specifications, system concepts, CAD generated using SolidWorks, detail drawings, BOM’s and budgets. Makes layouts of complex assemblies and details of parts of devices, mechanisms and structures.
• Provides customer product design engineering for economic production; may participate in meetings with customers.
• Assesses proper material, tooling, automation and equipment selection.
• Works with manufacturing to trouble-shoot problems, upgrades, retrofits, set-ups, methods development, and the development of process parameters.
• Participates in product development meetings and may make recommendations to product design changes to enhance manufacturing and assembly.
• Conduct proof of concept experiments and design other testing requirements as needed.
• Develop SOP’s operations and maintenance manuals.
• Research new technology or development tools to remain informed of current technology.
• Understanding of Lean Six Sigma tools, projects and processes and ability to incorporate these into assigned engineering projects.
• Reviews completed projects for accuracy, clarity and completeness.
• Ensures projects are compliant with all local, regional, and national regulatory requirements, codes and controls.
• Supports all company safety and quality programs and initiatives.
• May perform other duties and responsibilities as assigned.
  
  

Preferred Skills And Experience May Include

• Experience with Photonic, Laser, and ASIC components and micro-assembly;
• Experience in flip chip, chip on chip die attachment (on wafer), fiber attachment processes;
• 5+ years of solid experience in related work.
• Excellent ability to solve technical, scientific and experimental problems;
• Excellent teamwork and communication skills.
  
  

Required Education

• Master’s/PhD in Mechanical Engineering