Mechanical Engineer

Social networking, machine learning, and big data analytics demand ever-increasing network connectivity. RANOVUS, with operations in Ottawa, Canada, Nuremberg, Germany, and San Jose, USA, is a solution provider for the next generation data center infrastructures. We aim to deliver advanced technology that minimizes environmental impact through lower power dissipation. Working with world-class fabrication partners, RANOVUS is a leader in applying unique new technologies to fiber-optic communications products for data centers.

We are seeking a Mechanical Engineer to join our team.

As a successful candidate, you will work as the Photonic/ASIC Components integrator, collaborating with Photonics, High Speed ASIC, Laser design teams, and Ranovus’ CMs to define optimal assembly processes for high-volume Optical Engine (Module) manufacturing, targeted for data center applications. Your role will include supporting micro-assembly process development and manufacturing work instructions throughout all project phases, including NPI & production. Specifically, you will focus on improving and optimizing Silicon integrated photonic device manufacturing and assembly processes.

Responsibilities Generally Include

1. Design and develop complex sub-assemblies, components, and packaging.
2. Implement changes to product design and manufacturing processes to enhance efficiency, quality, and cost-effectiveness, participating in new product development programs.
3. Develop requirement specifications, system concepts, CAD models using SolidWorks, detailed drawings, BOMs, and budgets. Create layouts of complex assemblies and parts of devices, mechanisms, and structures.
4. Provide customer product design engineering support for economical production; participate in customer meetings as needed.
5. Assess appropriate materials, tooling, automation, and equipment selection.
6. Collaborate with manufacturing to troubleshoot issues, upgrades, retrofits, set-ups, methods development, and process parameter development.
7. Participate in product development meetings and recommend design changes to improve manufacturing and assembly.
8. Conduct proof of concept experiments and design testing protocols.
9. Develop SOPs, operations, and maintenance manuals.
10. Research new technologies and development tools to stay current.
11. Apply Lean Six Sigma tools, projects, and processes to engineering tasks.
12. Review completed projects for accuracy, clarity, and completeness.
13. Ensure compliance with all applicable regulatory requirements, codes, and standards.
14. Support safety and quality initiatives.
15. Perform other duties as assigned.

Preferred Skills And Experience May Include

1. Experience with Photonic, Laser, and ASIC components and micro-assembly.
2. Experience in flip chip, chip-on-chip die attachment (on wafer), and fiber attachment processes.
3. 5+ years of relevant professional experience.
4. Strong problem-solving skills in technical, scientific, and experimental contexts.
5. Excellent teamwork and communication skills.

Required Education

• Master’s or PhD in Mechanical Engineering.