Global Interconnects Product Line Manager

Ciena

Canada

On-site

CAD 153,322 - 255,537

Full time

12 days ago

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Benefits offered by this job

Health, dental, and vision plans
401(K) matching (USA) & DCPP (Canada)
ESPP
Employee Assistance Program (EAP)
Company-paid holidays
Paid sick leave
Vacation time
Paid Family Leave

Job summary

Ciena is seeking an experienced product leader for Interconnects to shape strategy, commercialization, and lifecycle execution of high-speed optical and electrical interconnect technologies used in data centers. You will drive roadmaps, coordinate with engineering, sales, customers, and partners, and translate needs into actionable specifications.

Qualifications include a 10+ year background in telecommunications components, expertise in co-packaged and near-packaged optics, and strong

Qualifications

  • Bachelor’s degree in Electrical Engineering.
  • 10+ years of technical experience in telecommunications or the component industry.
  • Experience with high-speed interconnect technologies including co-packaged optics, near-packaged optics, active electrical and copper cables, coherent, direct detect, SerDes, PHYs, and electro-optics.
  • Background in optical and electrical interconnect architectures and emerging component standards.
  • Utilization of component commercialization models including modules, bare die, and chiplets.
  • Experience defining commercialization requirements such as SDKs, documentation, and sales enablement frameworks.
  • Background working with cross-functional modem, component, and R&D teams to define and prioritize features and roadmaps.
  • Ability to translate customer and internal stakeholder requirements into product specifications and proposals, including responses to RFIs and RFPs.
  • Clear communication and presentation skills across technical and non-technical audiences.
  • Ability to manage multiple initiatives with minimal direction in a virtual or cross-functional environment.

Responsibilities

  • Define product strategy and multi-year roadmaps for optical and electrical interconnect technologies including co-packaged optics, near-packaged optics, advanced optical packaging, and electrical interconnects.
  • Lead commercialization efforts for optical and electrical interfaces, associated technologies, and in-house components.
  • Establish commercial offers and pricing structures aligned with industry norms.
  • Develop business cases and secure approvals for new features and initiatives.
  • Partner with marketing teams to create product positioning and customer-facing materials including presentations, data sheets, and competitive analyses.
  • Serve as a primary interface between engineering, sales, customers, and external technology partners.
  • Assess customer requirements, technology trends, regulatory considerations, and competitive dynamics to guide roadmap decisions.

Skills

High-speed interconnects
Cross-functional collaboration
Customer/stakeholder requirements
Technical communication
RFP/RFI responses
Roadmap leadership

Education

Bachelor’s degree in Electrical Engineering

Tools

SDKs
Sales enablement frameworks

Job description

Ciena is seeking an experienced product leader for Interconnects to shape strategy, commercialization, and lifecycle execution of high-speed optical and electrical interconnect technologies used in data centers. You will drive roadmaps, coordinate with engineering, sales, customers, and partners, and translate needs into actionable specifications.

Qualifications include a 10+ year background in telecommunications components, expertise in co-packaged and near-packaged optics, and strong

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