Director of Hardware Engineering

Broadcom; Ontario; On-site; CAD 130,000 - 160,000; Full time

Job summary

A leading company in Ontario is seeking a Director Hardware Engineer to lead a design team focused on high-performance electronic products. The role involves ownership of hardware design, collaboration with various engineering disciplines, and ensuring product quality throughout its lifecycle. Ideal candidates will have extensive experience in high-speed hardware design and a proven track record in product ownership.

Qualifications

• 15+ years of experience in engineering roles.
• Experience with high-speed signaling and complex product ownership.

Responsibilities

• Lead a design team developing high-performance electronic products.
• Own all aspects of EE hardware design, including BOM creation and validation.
• Collaborate with interdisciplinary teams and partner engineering teams.

Skills

Team Leadership

High-Speed Hardware Design

Lifecycle Product Ownership

Collaboration

Education

Bachelor's degree in Electrical Engineering

Tools

Precision Scopes

Analyzers

Validation Tools

Job description

As a Director Hardware Engineer , you will be the technical lead responsible for a design team developing and delivering Ultra High-performance electronic products. In addition to team leadership, technical leads participate in the process and are expected to own and design critical pieces of a solution. We are looking for candidates who thrive in a fast-paced, start-up-like environment and are proud of delivering high-quality products. You will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit / board design, development, and validation of a product range. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining. You will drive a philosophy of small teams of experienced engineers supporting a One Person One Board development culture.

You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. Additionally, joint development programs may require extensive interaction with partner engineering teams at an engineering leadership level.

Key Qualifications & Experience :

• Team Lead of High Speed Hardware designers.
• Experience with large high-powered SoCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 3D with memories.
• Proficiency with precision scopes, analyzers, and validation tools.
• Knowledge of power and thermal issues related to PCBs with 1kW+ footprints.
• Experience with high-speed & high-density signaling with SerDes rates of 112G+.
• Demonstrated lifecycle product ownership of complex products, from inception to volume production.
• Ability to work with support groups across various functions including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability.
• Bachelor's degree in electrical engineering and 15+ years of experience.
• Seniority level : Mid-Senior level
• Employment type : Full-time
• Job function : Engineering and Information Technology