MTS | SMTS | DMTS, AI-optimized Platform Architect

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our Opportunity Summary:

For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

Interested in changing the landscape of artificial intelligence workloads? Come join the team building very high-performance memory systems for AI! In the Systems Pathfinding organization at Micron, we drive concepts across the stack, from applications to architectures and from concept to product. This is your opportunity to make a difference in the future of computing!

As a Technical Leadership Member in our AI-optimized Memory Platform Architecture team, you will contribute to the definition of platform architecture for groundbreaking, tightly coupled memory systems tailored for AI workloads. Joining our expanding team of domain experts across platforms, systems architecture, component design, and advanced packaging, you’ll analyze platform architecture trade-offs in close collaboration with design and packaging teams. Your responsibilities will encompass the definition of SoC and IP architectures, evaluation and specification of power delivery architectures, and definition of on- and off-chip interfaces.

Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams across worldwide geographies! Enabling the creative career path you deserve with a collaborative environment and groundbreaking technology and growing upon your imagination and creativity.

*This will be a hybrid role based out of either our Folsom or San Jose, CA offices.

*The Seniority level will be determined by a combination of education and experience.

What's Encouraged Daily:

• Architect SoCs and platform architectures for high-performance stacked memories, including power delivery, interconnects, IOs, and thermals.
• Collaborate with experts across SoC/memory design, memory systems architecture, and advanced packaging to explore tradeoffs and define architectures and requirements.
• Create and maintain architecture documentation.
• Contribute to prototype platform development.

What we're looking for:

• Experience with platform architecture: analysis, definition, and development of sophisticated systems, especially those constructed with advanced packaging techniques.
• Experience with high-performance memory devices and memory systems, like HBM.
• Design and architecture experience with leading-edge foundry nodes.
• Experience with 2.5D and 3D interconnects and interfaces, including PCIe, UCIe, and HBM interconnects.
• Experience with power delivery and thermal architectures and analysis.

What sets candidates apart:

• Experience with advanced packaging building blocks and techniques.
• Experience with high efficiency, stacked architectures and designs.
• Contributions to system-on-a-chip (SoC) and memory system architecture and design.
• Ability to influence decisions through data-driven systems analysis.
• A Masters, PhD, or equivalent experience in Computer Science, Computer Engineering, Electrical Engineering, or related field.
• 10+ years of proven experience.

(Disclaimer): While you may not exhibit all of the characteristics/skills listed above today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of premier engineers. In that case, we are determined to help build upon your existing foundation, while rapidly growing your individual and collaborative skills in this exciting and outstanding opportunity.