6723 - Design Engineer – Advanced Semiconductor Tool Modules | CREO Windchill | TCB Focus

The Supreme HR Advisory; Alberta; On-site; CAD 80,000 - 100,000; Full time

Job summary

A leading HR consultancy is seeking a TCB Design Engineer to design and optimize TCB module systems for advanced semiconductor packaging. The ideal candidate will have a degree in a relevant field and 2-5 years of experience in design and development related to semiconductor processes. Strong CAD skills and familiarity with TCB technologies are essential. This position is based in Alberta, Canada.

Qualifications

• 2-5 years of hands-on experience in design and development of equipment or semiconductor packaging.
• Experience with TCB or Laser Assisted bonding technologies is preferred.
• Familiarity with analytical tools such as X-ray and SAM is required.

Responsibilities

• Design innovative TCB module assemblies for bonding processes.
• Oversee fabrication of prototype modules and analyze test results.
• Collaborate with engineers for machine integration and process improvements.

Skills

3D/2D CAD knowledge

Trouble-shooting skills

Materials behaviour under thermal/mechanical stress

Excellent knowledge of risk analysis

Education

Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering

Tools

CREO Parametric

X-ray analysis tools

Statistical analysis software (JMP, Minitab)

Job description

Overview

Position title: TCB (Thermo Compression Bonding) Design Engineer

Location: Admiralty Street

Working Days: 5 Day A Week

Working hours: 9:00am - 6:00pm

Salary: $6000 - $8000 (depends experience)

Role Overview

A TCB Design Engineer is responsible for designing, developing, and optimizing the TCB modules subsystem used in Thermo-Compression Bonding (TCB) equipment for advanced semiconductor packaging. This role is critical for ensuring precise, uniform, and rapid thermal control during Chip-to-Wafer or Chip-to-Substrate bonding, directly impacting process reliability, yield, and throughput.

Key Responsibilities

Must-have:

• Design & Development: Design innovative TCB modules assemblies for Chip-to-Wafer or Chip-to-Substrate bonding; Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, DFMA (Design for Manufacturability and Assembly); Planning, Scheduling and Costing of Machine Modules.
• Prototyping & Testing: Oversee fabrication of prototype modules and their integration with TCB platforms; Analyze test results, identify design improvements, and troubleshoot failures related to temperature non-uniformity, inefficiency, or material degradation.
• Process & Manufacturing Support: Collaborate with Electrical, Vision and Software Engineers for the machine integration; Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls); Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems; Support transfer of new heater designs from R&D to production, including documentation, BOM, and assembly guides.
• Compliance & Documentation: Document all designs, simulations, and test results according to quality management and IP standards; Remain updated on relevant industry standards for environment, health and safety, contamination control, and semiconductor packaging equipment.

Good-to-have:

• Thermal & Mechanical Analysis: Perform thermal simulations (CFD, FEA) to optimize heating/cooling profiles and minimize thermal gradients across the TCB bondhead/ bondstage; Design and validate cooling channels (e.g., for air or liquid) inside the bondhead/ bondstage to achieve rapid cooling and enhance temperature uniformity; Mounting of the heater assembly for micron-level Z positioning and planarity during operation.

Requirements

• Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Minimum 2–5 years of hands-on experience in design and development of equipment's or semiconductor packaging or advanced interconnect processes.
• 3D/2D CAD knowledge, with experience in CREO Parametric preferred. Exposure to CREO Windchill PLM system is a plus.
• Experience with TCB or Laser Assisted bonding technologies is highly preferred.
• Familiarity with bonding equipment and analytical tools (X-ray, SAM, OM, etc.)
• Excellent knowledge of trouble-shooting, risk analysis, FMEA, and statistical analysis (JMP, Minitab).
• Knowledge of bonding process and materials behaviour under thermal/mechanical stress (e.g., CTE mismatch, flux residue, underfill cure).
• Experience in design and development of Modules like Bond head, Bond Stage, Thin Die Handling, Large Die Handling, Clean Room Class 100 Systems, Plasma Modules, N2 System is a plus. Experience with thermal system/component design (heaters, sensors, thermal interfaces), including hands-on and simulation skills.
• Experience on HBM, COWOS, 2.5D, Fluxless Bonding is a definite plus

Contacts

WhatsApp: [phone] (Han)

Email: [e-mail]

Chaw Chiaw Han, Reg No: R22106723

The Supreme HR Advisory Pte Ltd, EA No: 14c7279