Senior Manager, HBM Customer Integration & System Engineering

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Região Norte; Presencial; BRL 300 000 - 420 000; Tempo integral

Resumo da oferta

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD is seeking an experienced senior leader in semiconductor engineering to guide cross-functional teams through customer integration, system engineering, and qualification. You will collaborate with design, product, and manufacturing teams to deliver robust product solutions and scalable engagement models, while advancing HBM architectures and AI-driven automation.

The role requires 10+ years of leadership in semiconductor programs, exceptional

Qualificações

• Bachelor/Master degree in Electrical or Computer Engineering or related field
• 10+ years in semiconductor engineering, system integration, or leadership roles
• Strong understanding of HBM architecture, system integration, packaging, manufacturing
• Proven ability to lead global cross-functional teams and influence executives
• Excellent communication, leadership and problem-solving skills

Responsabilidades

• Lead and develop teams responsible for customer integration, technical engagement, and system engineering.
• Drive customer technical interlocks, design reviews, escalations, and integration activities.
• Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions.
• Provide leadership in HBM architecture, system integration, packaging, manufacturing, and customer enablement.
• Establish scalable engagement models, governance processes, and executive communications for customer deployment and qualification.
• Drive resolution of complex technical issues while influencing future product and technology roadmaps.
• Develops and deploys AI systems to automate processes and solve technical challenges.

Conhecimentos

Electrical engineering

System integration

Leadership

Customer-facing leadership

Communication skills

Formação académica

BS/MS in Electrical/Computer Engineering

Descrição da oferta de emprego

Key Responsibilities

• Lead and develop teams responsible for customer integration, technical engagement, and system engineering.

• Drive customer technical interlocks, design reviews, escalations, and integration activities.

• Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions.

• Provide leadership in HBM architecture, system integration, packaging, manufacturing, and customer enablement.

• Establish scalable engagement models, governance processes, and executive communications that enable successful customer deployment and qualification.

• Drive resolution of complex technical issues while influencing future product and technology roadmaps.

• Develops and deploys AI (artificial intelligence) systems that help automate processes and solve technical challenges.

Qualifications

• BS/MS in Electrical Engineering, Computer Engineering, or related field.

• 10+ years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience

• Strong understanding of HBM architecture, system integration, packaging, manufacturing processes, and customer qualification.

• Proven ability to lead global cross-functional teams and influence executive-level stakeholders and customers.

• Excellent communication, leadership, and problem-solving skills

Preferred Experience

• Customer-facing leadership experience with hyperscale, AI, networking, or semiconductor customers.

• Experience leading geographically distributed teams across Asia and the United States.

• Knowledge of advanced memory solutions, AI systems, and high-performance computing platforms.