Senior Engineer, CMOS Process Integration, NTI

Micron Technology, Inc.; Região Norte; On-site; BRL 614,000 - 964,000; Full time

Job summary

Micron Technology, Inc. is seeking a Staff/Principal NAND CMOS Module Process Integration Engineer in Singapore.

You will design and implement innovative process solutions to improve next-generation 3D NAND yield and quality while balancing cost and performance in a fast-moving R&D environment. You will lead cross-functional teams, define criteria for optimal product performance, and drive technology transfer from R&D to manufacturing.

Qualifications

• Bachelor/Master/PhD in a relevant engineering field with strong semiconductor background.
• Experience in PI modules, yield improvement, and device/process interactions.
• Proven ability to lead cross-functional teams and communicate complex technical data.

Responsibilities

• Identify module deficiencies and lead cross-functional teams to address issues.
• Develop CSPEC criteria for optimal product performance and process capability.
• Coordinate activities to secure funding for experiments and transfers to manufacturing.
• Lead quarterly yieldSummits and monthly reviews to align R&D, manufacturing and senior management.
• Assist in transfer of new technology from R&D to manufacturing.
• Integrate AI-enabled tools to improve efficiency, quality, and insights across PI tasks.

Skills

Data analysis

Problem solving

Process integration

Cross-functional teamwork

Communication

Self-motivation

Education

PhD in Electrical Engineering / Microelectronics

Tools

Python

SolidWorks

Tableau

Power BI

Job description

As a Staff/Principal NAND CMOS Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline.

Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability

• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability

• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners

• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility

• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams

• Assist in the transfer of new technology from R&D to manufacturing

• Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing

• AI Responsibilities:

  • Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
  • Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
  • Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes

Successful candidates for this position,

Must have:

• Passion in semiconductor technology and innovation

• Adept at data analysis, problem-solving, and process integration optimization

• Excellent communication skills and ability to work in cross-functional teams

• Committed to quality, collaboration, and continuous improvement

• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment

• Ability to travel for extended periods to the US for collaborative R&D work

Requirements:

• BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field

• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable

• Minimum of 3 years of experience in the semiconductor industry in the areas ofProcess Integration and Yield Enhancement

• Ability to develop a strong holistic end‑to‑end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms

• In-depth knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable

• Exposure to R&D such as HKMG is desirable