Senior Engineer, Process Engineering | Global R&D Process Engineering Program
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, ASM's advanced semiconductor devices play a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.
As a Senior Engineer, Process Engineering within ASM’s Global R&D Process Engineering Program, you will develop next‑generation semiconductor technologies. For the first 18 to 24 months, you will onboard into a comprehensive development program, combining structured learning with hands‑on work using ASM’s world‑leading semiconductor processing equipment. This phase is designed to accelerate technical depth, process mastery, and integration into ASM’s global R&D community.
Following this phase, you will relocate to an ASM R&D center in Japan, Korea, or the United States for a permanent role.
Take a closer look at the role
- Work with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD.
- Develop innovative ideas, staying abreast of state‑of‑the‑art processing applications in the semiconductor industry.
- Process consulting, including writing technical papers on advanced process applications and intellectual property creation.
- Participate in and drive technical problem‑solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
- Design and conduct experiments, measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
- Troubleshoot equipment problems and engage in hands‑on modalities.
- Work directly with customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
- Develop methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
- Ensure successful product transfer to customer base by performing demonstrations, traveling to support customer sites (up to 10% travel), and drafting documentation regarding process development, tool operation and maintenance.
- Produce technical papers on process, equipment, and device integration improvement strategies and present to professional audiences.
Qualifications
- PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
- 0–7+ years of combined education, research, and work experience with cure, oxidation, ALD, CVD, Epitaxy, PECVD and/or other thin film deposition.
- Experience with materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM and ellipsometry.
- Knowledge of electrical characterization techniques for CMOS devices.
- Application of dielectric and/or metal films for logic and memory structures.
- Training in computational fluid dynamics (CFD), either theoretical or practical is preferred.
Skills
- Ability to independently manage complex process development projects.
- Creative problem solving with experience in developing new films for emerging applications and in chemistry/materials characterization.
- Understanding of interplay between hardware design (e.g., chemical reactor design) and operation and process outputs.
- Understanding of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows.
- Demonstrated ability to develop and fully characterize deposition processes using first principles and experimental design techniques such as DOE and RSM.
- Experience with theory, practice and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
- Excellent verbal and written communication skills, with ability to clearly communicate advanced technical concepts.
Work location & transfer requirements
For the first 18–24 months, you will complete training at flagship process development hubs in Leuven (Belgium), or Helsinki (Finland). Upon completion, you will transfer to a Key Product Unit Process team for a permanent role in Greater Tokyo, Japan; Phoenix, Arizona, US; or Dongtan Semiconductor Valley, South Korea.
Why join ASM?
- Long‑term investment in R&D talent with a program designed to accelerate careers.
- Financially strong technology leader in ALD with a long‑term vision, values‑driven culture, and defensible IP portfolio.
- Process engineering at ASM is rooted in scientific rigor and technical excellence, with original thinking, teamwork, and high‑impact intellectual property driving technology roadmaps.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identity or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.