Senior Technical Program Manager - Semiconductors

First Nations Jobs; Australia; Presencial; AUD 140 000 - 180 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Salary range 140k–180k AUD

Equity opportunities

12% superannuation contributions

Flexible leave policy

Professional growth in a high-impact,早

Resumo da oferta

Syenta is seeking a high-ownership Senior Technical Program Manager to lead end-to-end programs across materials, process engineering and fabrication teams in Australia. You will drive execution to meet tight, technically complex deadlines and align global departments to ensure seamless outcomes.

The role requires strong risk management, proactive communication with executive stakeholders and a track record of delivering breakthrough results in advanced packaging or MEMS environments.

Qualificações

• 10+ years managing complex technical programs

Responsabilidades

• Owns the end-to-end project lifecycle, driving execution against tight, technically complex deadlines.
• Creates and manages core PM artifacts including schedules, resource forecasts, and risk/issues logs.
• Aligns multiple international departments (materials scientists, chemists, process engineers) to ensure seamless execution; manages external supplier and fab relationships.
• Collects, analyzes and publishes program performance data via dashboards and status reports; translates data into actionable process improvements.

Conhecimentos

Program management

Semiconductor programs

Supplier management

Cross-functional leadership

Technical fluency

Executive communication

Formação académica

PMP certification

Scrum Master

Descrição da oferta de emprego

Syenta is seeking a high-ownership Senior Technical Program Manager to lead end-to-end programs across materials, process engineering and fabrication teams in Australia. You will drive execution to meet tight, technically complex deadlines and align global departments to ensure seamless outcomes.

The role requires strong risk management, proactive communication with executive stakeholders and a track record of delivering breakthrough results in advanced packaging or MEMS environments.