Senior Copper Electrodeposition Scientist – LEM Packaging

Syenta; Sydney; On-site; AUD 180,000 - 240,000; Full time

Benefits offered by this job

Competitive salary

Equity opportunities

12% superannuation

Flexible leave policies

Professional growth

Job summary

Syenta is seeking a hands‑on electrochemist to lead copper electrodeposition development for advanced packaging interconnects. You will diagnose failures, design focused experiments, and turn outcomes into repeatable, scalable recipes.

You’ll work with process and equipment engineers to shape copper deposition in copper damascene and high aspect ratio structures. You will apply kinetic, mass transport, and current distribution insights to improve uniformity and yield, while translating lab

Qualifications

• Typically 5–10 years of relevant experience with independent technical problem‑solving and process development.

Responsibilities

• Lead the development and optimisation of copper electrodeposition processes for fine‑pitch RDL, microvias and high‑aspect‑ratio structures.
• Investigate electrochemical kinetics, mass transport, current distribution, nucleation and deposition morphology.
• Develop electrolyte formulations, additives and operating conditions to improve uniformity, filling quality and defect performance.
• Identify and eliminate deposition defects, including voids, shorts, overplating, roughness and nonuniform growth.
• Design and execute rigorous experiments (DOE) to establish robust and reproducible process windows.
• Develop stamp pre‑plating, conditioning, recharging and cleaning processes.
• Apply electrochemical characterisation techniques, including cyclic voltammetry, chronoamperometry, impedance spectroscopy and polarisation measurements.
• Correlate electrochemical behaviour with SEM/FIB cross‑sections, surface metrology, material properties and electrical performance.
• Collaborate closely with process and equipment engineers to translate laboratory results into scalable manufacturing systems.
• Define electrochemical requirements for automated plating equipment, electrolyte delivery, multi‑zone current control and in‑line process monitoring.
• Document experimental results, establish SOPs and drive continuous improvement in process yield, repeatability and throughput.

Skills

Electrochemistry

Process development

DOE design

Data analysis

Lab troubleshooting

Interfacial phenomena

Problem solving

Education

Electrochemistry degree

Chemical engineering degree

Materials science degree

Tools

SEM

FIB

Electrochemical instrumentation

Job description

Syenta is seeking a hands‑on electrochemist to lead copper electrodeposition development for advanced packaging interconnects. You will diagnose failures, design focused experiments, and turn outcomes into repeatable, scalable recipes.

You’ll work with process and equipment engineers to shape copper deposition in copper damascene and high aspect ratio structures. You will apply kinetic, mass transport, and current distribution insights to improve uniformity and yield, while translating lab