Copper Electrodeposition Engineer for Advanced Packaging

Syenta; Sydney; On-site; AUD 90,000 - 130,000; Full time

Benefits offered by this job

Competitive salary

Early-stage equity opportunities

12% superannuation contributions

Flexible leave policies

Professional growth in a high-impact,深

Job summary

Syenta is pioneering Localized Electrochemical Manufacturing (LEM) for advanced packaging interconnects. The role focuses on diagnosing failed copper deposits, designing experiments to pinpoint causes, and turning results into repeatable recipes for production-scale plating systems.

You will work with process and equipment engineers to ensure the plating systems meet specifications, improve yield, and scale lab results to manufacturing environments. A hands-on, fast-moving approach is essential.

Qualifications

• Bachelor-level or higher in Electrochemistry, Chemical Engineering, Materials Science or related field.
• Hands-on experience with electrodeposition processes and troubleshooting.
• Strong understanding of electrochemical kinetics, mass transport and interfacial phenomena.

Responsibilities

• Develop and optimize copper electrodeposition processes for fine-pitch structures.
• Investigate kinetics, mass transport, current distribution and deposition morphology.
• Develop electrolyte formulations and operating conditions to improve uniformity and yield.
• Identify and eliminate deposition defects (voids, overplating, nonuniform growth).
• Plan and execute DOE experiments to establish robust process windows.

Skills

Electrodeposition

Electrochemistry

DOE

Data analysis

Problem solving

Education

Degree in Electrochemistry

Tools

Electrochemical instrumentation

Job description

Syenta is pioneering Localized Electrochemical Manufacturing (LEM) for advanced packaging interconnects. The role focuses on diagnosing failed copper deposits, designing experiments to pinpoint causes, and turning results into repeatable recipes for production-scale plating systems.

You will work with process and equipment engineers to ensure the plating systems meet specifications, improve yield, and scale lab results to manufacturing environments. A hands-on, fast-moving approach is essential.