Process Engineer IC Substrate - Lithography & Yield Expert

At&S Ag

Kühnsdorf

Hybrid

EUR 60,000 - 90,000

Full time

5 days ago
Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Growth opportunities
Onboarding program
Modern canteen meals
Free parking and EV charging
Health benefits

Job summary

AT&S AG in Leoben, Austria, seeks a Process Engineer IC Substrate to develop, optimize, and stabilize lithography processes for IC substrate production. You will qualify equipment, monitor performance, and lead experiments to improve yield, cycle time, and costs.

The role requires a university degree in a technical field, hands-on process engineering experience, and proficiency in data analysis and JMP. English fluency is essential; travel to AT&S locations may be required.

Qualifications

  • University degree in Materials Science, Mechanical Engineering, Industrial Engineering, Chemistry, or a related technical field.
  • Practical knowledge of process engineering, data analysis, and design of experiments with hands-on JMP experience.
  • Familiarity with quality and Six Sigma methods such as SPC, MSA, DOE, FMEA, 8D, 5 Why, and control plans.
  • Experience with lithography or exposure processes is an advantage.

Responsibilities

  • Develop, optimize, and characterize lithography processes for IC substrate manufacturing, with a focus on stable and reliable production.
  • Qualify new process equipment and take ownership of equipment, tooling, and process parameters.
  • Monitor process performance, stability, yield, and trends using SPC and data analysis.
  • Investigate process deviations and equipment issues using structured problem-solving methods.
  • Plan and conduct experiments to improve process performance, yield, reliability, throughput, cycle time, and costs.
  • Support new product ramp-ups, process technology development, and transfer of processes to high-volume manufacturing.
  • Maintain process recipes, specifications, procedures, reports, and change documentation.
  • Collaborate with Engineering, Integration, NPI, Testing, Maintenance, and other AT&S locations to implement improvements and transfer knowledge.

Skills

Fluent English
Data analysis
Design of experiments
Six Sigma

Education

University degree in Materials Science, Mechanical Engineering, Industrial Engineering, Chemistry, or related field

Tools

JMP

Job description

AT&S AG in Leoben, Austria, seeks a Process Engineer IC Substrate to develop, optimize, and stabilize lithography processes for IC substrate production. You will qualify equipment, monitor performance, and lead experiments to improve yield, cycle time, and costs.

The role requires a university degree in a technical field, hands-on process engineering experience, and proficiency in data analysis and JMP. English fluency is essential; travel to AT&S locations may be required.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Process Engineer IC Substrate – Lithography & Yield
Process Engineer IC Substrate – Lithography & Yield

AT&S • Leoben

On-site
EUR 65,000 - 90,000
Long-term growth in international env.
Tailored onboarding program
Modern canteen
+2
Process Engineer IC Substrate
Process Engineer IC Substrate

At&S Ag • Kühnsdorf

Hybrid
EUR 60,000 - 90,000
Growth opportunities
Onboarding program
Modern canteen meals
+2
Process Engineer IC Substrate
Process Engineer IC Substrate

AT&S • Leoben

On-site
EUR 65,000 - 90,000
Long-term growth in international env.
Tailored onboarding program
Modern canteen
+2
Senior R&D Engineer: Patterning & Lithography
Senior R&D Engineer: Patterning & Lithography

AT&S • Leoben

On-site
EUR 90,000 - 130,000
Growth opportunities
International environment
Onboarding program
+3
Senior Engineer R&D - Patterning Process
Senior Engineer R&D - Patterning Process

AT&S • Leoben

On-site
EUR 90,000 - 130,000
Growth opportunities
International environment
Onboarding program
+3
Senior Expert - Substrate & Packaging Industrialization
Senior Expert - Substrate & Packaging Industrialization

Austria Technologie & Systemtechnik AG • Leoben

On-site
EUR 45,000 - 65,000
Structured onboarding program
Continual training opportunities
Modern company canteen
+2
Senior Engineer Glass Core Build-Up Process
Senior Engineer Glass Core Build-Up Process

AT&S • Leoben

On-site
EUR 90,000 - 130,000
Long-term growth in international env.
Onboarding program & training
Modern canteen
+2
Principal Engineer R&D - Build-up Process
Principal Engineer R&D - Build-up Process

AT&S • Leoben

On-site
EUR 90,000 - 130,000
Long-term growth in international env.
Onboarding program & training
Modern canteen
+2
Senior Expert, Substrate & Packaging Integration
Senior Expert, Substrate & Packaging Integration

Austria Technologie & Systemtechnik AG • Leoben

On-site
EUR 45,000 - 65,000
Structured onboarding program
Continual training opportunities
Modern company canteen
+2
Produktionsexperte Leiterplatten – Leoben, 5-Schicht
Produktionsexperte Leiterplatten – Leoben, 5-Schicht

At&S Ag • Leoben

On-site
EUR 28,000 - 36,000
Attraktive Schichtmodelle mit freienWo
Bezahlte Pausen
Möglichkeiten zur beruflichen Weiter-/
+3