Vice President Hardware Engineering

Teksky LLC; San Jose (CA); On-site; USD 260,000 - 340,000; Full time

Job summary

Teksky LLC seeks a VP of HW Systems Engineering to lead the hardware organization, owning the lifecycle of TCU products from concept to high‑volume production. You will manage senior engineers and contractors, champion secure server infrastructure, and drive open hardware ecosystems including OCP.

The role requires elite hands-on design abilities, systems debugging, and the ability to navigate supply-chain constrained environments in a lab-focused setting.

Qualifications

• 20+ years of hardware engineering leadership in server, data center, or semiconductor ecosystems.
• Proven history of taking complex board designs to high-volume production with excellent yields and resolving field RMA issues.
• Hands-on circuit design, lab testing, and platform troubleshooting.
• Strong knowledge of OCP DC-SCM standards and DC-SCI interfaces.
• Solid network across hyperscaler and OEM partners.

Responsibilities

• Drive TCU-based embedded systems from concept through high-volume production with hands-on execution.
• Take complex board designs to mass production while optimizing DFM/DFT, test coverage, and yields.
• Oversee fault resolution of field returns, driving FA and corrective actions to improve reliability.
• Partner with ASIC, silicon, firmware, and software teams to isolate and resolve complex bugs.
• Lead first-silicon and lab bring-up, EVT/DVT testing, and lab validation.
• Represent the company in OCP and hardware industry forums.
• Pivot board layouts based on real-time parts availability and manage Tier-1 supplier relationships.
• Drive schematic development using Cadence OrCAD and collaborate across teams to meet OCP DC-SCM and NVIDIA IFF form factors.

Skills

Leadership

Experience 20+ yrs

Mass production

Schematic design

OCP DC-SCM

Cadence OrCAD/Allegro

PCIe interfaces

Linux scripting

Stakeholder comms

Education

Bachelor/Master in EE

Tools

Cadence OrCAD/Allegro

Job description

We are seeking an agile, results-driven VP of HW Systems Engineering to lead our hardware organization. In this highly visible role, you will own the hardware product lifecycle from concept to high-volume production for Trusted Control/Compute Unit (TCU) products. This role requires an executive with elite, hands-on design and debugging capabilities who thrives in the lab and effectively navigates dynamic, supplychain-constrained environments. You will manage senior engineers and contractors, help customers build secure server infrastructure, and champion open hardware ecosystems such as the Open Compute Project (OCP).

Key Responsibilities

• Leadership & Execution: Drive TCU-based embedded systems from initial concept through high-volume production with active, hands‑on daily execution.
• Mass Production & Yield: Take complex board designs to mass production while optimizing DFM/DFT, factory test coverage, and production yields.
• Sustaining & RMA Support: Oversee the technical resolution of customer field returns, driving Failure Analysis (FA) and corrective actions to improve reliability.
• Root-Cause Triage: Partner with cross-company ASIC, silicon, firmware, and software teams to systematically isolate and resolve complex system bugs.
• Lab Validation: Personally lead first‑silicon and platform bring‑up, low‑level bus validation, and EVT/DVT testing in the lab.
• OCP & Industry Forums: Integrate OCP DC‑SCM standards and represent the company within OCP and other industry hardware forums.
• Supply Chain Agility: Pivot board layouts responsively based on real‑time parts availability and manage critical Tier‑1 supplier relationships.
• Design & Review: Drive schematic development using Cadence OrCAD and collaborate with Layout, Mechanical, and SI engineers to meet OCP DC‑SCM and NVIDIA IFF form factors.

Qualifications

• Experience & Education: 20+ years of hardware engineering experience with a leadership track record in server, data center, or semiconductor ecosystems. B.S. or M.S. in Electrical Engineering (EE).
• Production Track Record: Proven history of taking complex board designs to high-volume production with excellent yields and resolving field RMA issues.
• Hands‑on Technical Mastery: Deep, continuous experience with circuit design, schematic capture, laboratory equipment, and platform troubleshooting.
• DC‑SCM & Ecosystem Expertise: Strong knowledge of OCP DC‑SCM standard solutions, including DC‑SCI interfaces and form factors, along with a solid network across hyperscaler and OEM partners.
• Supply Chain Agility: Demonstrated capability to execute rapid hardware redesigns, footprint compatibility strategies, and alternative component sourcing.
• Tool & Interface Proficiency: Expert familiarity with Cadence OrCAD/Allegro and server interfaces including PCIe, USB, I2C, SMBus, SPI, UART, MCTP, eSPI, and LTPI.
• Architecture & Software Knowledge: Solid understanding of modern CPU/GPU architectures and the Linux environment, including Python or Bash scripting.
• Communication: Exceptional verbal and written communication skills to articulate hardware‑anchored security and supply chain strategies to enterprise stakeholders.