Tooling Engineer for AI Satellites - On-Orbit Compute

SpaceX; Bastrop (TX); On-site; USD 110,000 - 160,000; Full time

Job summary

SpaceX is seeking a Tooling Engineer for the Starmind team to own the manufacturing line for the hardware enabling on-orbit AI processing. You will oversee assembly, integration, and testing of high-performance compute electronics, memory, and networking.

Responsibilities include developing in-house machining capability, optimizing tooling costs, and collaborating with design, upstream production, and suppliers to ensure robust, scalable manufacturing for high‑volume space-grade hardware.

Qualifications

• Bachelor’s degree in an engineering discipline.
• 3+ years of CNC machining experience.
• Strong CAD skills with NX and large assemblies.

Responsibilities

• Develop in-house machining capability for tooling and deliver precision parts.
• Analyze parts and assemblies for DFM to optimize manufacturing and assembly.
• Collaborate with design engineering, upstream production, and suppliers.
• Coordinate between manufacturing and design to ensure robust processes and quick issue resolution.
• Implement machining process controls to enable lights-out production.
• Identify, procure, and install shop equipment and ensure maintenance.
• Support cost optimization and reduction initiatives for fabrication and processes.
• Develop and manage engineering capacity, schedules, and project plans for production manifest.
• Research new materials and finishing options.
• Estimate prototype and production manufacturing costs for tooling and assembly.
• Publish detailed schedules for each development project segment.

Skills

CNC machining

DFM

Cross-functional

Cost optimization

Project planning

Education

Bachelor’s degree in engineering

Master’s or PhD in engineering

Tools

Siemens NX

3D CAD (large assemblies)

Job description

SpaceX is seeking a Tooling Engineer for the Starmind team to own the manufacturing line for the hardware enabling on-orbit AI processing. You will oversee assembly, integration, and testing of high-performance compute electronics, memory, and networking.

Responsibilities include developing in-house machining capability, optimizing tooling costs, and collaborating with design, upstream production, and suppliers to ensure robust, scalable manufacturing for high‑volume space-grade hardware.