Thermal/ Mechanical Engineer

Socket.dev; San Jose (CA); On-site; USD 137,000 - 209,000; Full time

Benefits offered by this job

Annual bonus

RSU/Equity

Health care

Employee Stock Purchase Plan (ESPP)

Job summary

QuantumScape is seeking an experienced Thermal/Mechanical Engineer to own the physical design of a high-density PSU+BBU shelf for hyperscale AI data centers. You will translate boards and battery packs into a manufacturable enclosure that fits a rack, cools adequately, and is serviceable in seconds.

You will run CFD analyses, ensure ORv3 compliance, and collaborate across battery, power electronics, and hyperscaler teams to shorten qualification timelines.

Qualifications

• 8+ years designing thermal-mechanical enclosures for rack-mount power, compute, or telecom equipment.
• Must have CFD thermal simulation experience (Ansys Icepak, FloTHERM, or 6SigmaET).
• Proficiency in SolidWorks or Creo for detailed mechanical design.

Responsibilities

• Design the complete mechanical enclosure (1U or 2U shelf) in SolidWorks or Creo.
• Solve the core thermal challenge: interface with battery packs and power electronics.
• Run CFD simulations to optimize airflow under worst-case conditions.
• Design to OCP ORv3 mechanical specifications for shelf dimensions and interfaces.
• Develop hot-swap sled mechanism with proper insertion/extraction forces.
• Collaborate with battery systems engineer on mounting and thermal interface materials.
• Perform vibration and shock analysis for shipping (ISTA 3-series) and seismic requirements.
• Lead DFM engagement with contract manufacturers for tolerances and assembly sequence optimization.
• Support UL 62368-1 mechanical and flammability requirements.
• Interface with hyperscaler mechanical teams during qualification reviews.

Skills

Thermal-mech enclosure design

CFD simulations

SolidWorks/Creo

Sheet metal design

Production/CM manufacturing

Rack airflow management

Vibration/shock testing

UL 62368-1 familiarity

Tools

Ansys Icepak

FloTHERM

6SigmaET

Job description

QuantumScape is on a mission to transform energy storage with solid-state lithium-metal battery technology. The company’s next-generation batteries are designed to enable greater energy density, faster charging and enhanced safety to support the transition away from legacy energy sources toward a lower carbon future.

About the role:

We are building an integrated PSU+BBU rack power shelf that combines power conversion and solid-state battery backup into a single high-density platform for hyperscale AI data centers.

This shelf must conform to OCP Open Rack/ ORv3 mechanical specifications, manage two thermally incompatible subsystems within a shared enclosure, and pass hyperscaler qualification - which is as much a mechanical and thermal review as an electrical one.

As Thermal/ Mechanical Engineer, you own the physical design of the product. You translate circuit boards and battery packs into a manufacturable shelf that fits the rack, survives the data center environment, and can be serviced by a technician in seconds.

Why this role matters:

Hyperscalers don't negotiate on rack geometry. If the shelf doesn't fit, doesn't cool, or can't be serviced in seconds, it doesn't get evaluated- regardless of how good the electrical design is. You are also the company's primary interface to the hyperscaler's mechanical integration team during qualification. Your design fluency with their unwritten preferences (not just the published specs) can compress the qualification timeline by months. In a product where power electronics and battery cells share a tight enclosure, you are the person who makes coexistence physically possible.

What you'll do:

• Design the complete mechanical enclosure (1OU or 2OU shelf) in SolidWorks or Creo: sheet metal chassis, busbar routing, internal structural supports, and external connector interfaces
• Solve the core thermal challenge: power semiconductors and magnetics (tolerant to 100-125°C junction) sharing an enclosure with solid-state battery cells (requiring sub-45-60°C operation) - via directed airflow paths, thermal isolation zones, heat spreaders, and fan selection
• Run CFD simulations (Ansys Icepak, FloTHERM, or 6SigmaET) to optimize airflow distribution under worst-case conditions: full electrical load, 35-40°C inlet air (ASHRAE A1/A2), fan degradation scenarios
• Design to OCP ORv3 mechanical specifications:shelf width, depth, connector position, airflow direction (front-to-back), ejector handle placement, guide rail interface, and weight-per-OU limits
• Develop the hot-swap sled mechanism with proper insertion/extraction force curves, blind-mate power connector alignment, and guide rail compliance for tool-less serviceability
• Collaborate with the battery systems engineer on cell pack mounting, compression, thermal interface materials, and mechanical isolation within the enclosure
• Perform vibration and shock analysis for shipping (ISTA 3-series) and seismic requirements (GR-63-CORE or Bellcore Zone 4)
• Lead DFM engagement with contract manufacturers: tolerances, tooling, bend radii, spot welding, PEM fastener insertion, and assembly sequence optimization
• Support UL 62368-1 mechanical and flammability requirements (material selection for 94 V-0, spacing, enclosure integrity)
• Interface directly with hyperscaler mechanical integration teams during qualification reviews

What you bring:

• 8+ years designing thermal-mechanical enclosures for rack-mount power, compute, or telecom equipment

• Demonstrated experience with CFD thermal simulation tools (Ansys Icepak, FloTHERM, or 6SigmaET) - not optional
• Proficiency in SolidWorks or Creo for detailed mechanical design
• Sheet metal design for volume manufacturing (bend radii, punching/stamping, spot welding, tolerance stackup analysis)
• Track record of designs that went through contract manufacturing and passed thermal validation in a production or data center environment
• Understanding of airflow management in forced-convection rack environments

Nice to have:

• Direct experience with OCP Open Rack/ ORv3 mechanical specifications
• Prior work on battery pack thermal management (EV, stationary storage, or telecom backup)
• Exposure to liquid cooling or cold plate design (emerging trend for rack power shelves)
• Experience with blind-mate connector integration (Amphenol, TE Connectivity, or Molex high-power connectors)
• Familiarity with UL 62368-1 mechanical/flammability requirements and UL 1973 battery enclosure requirements
• Knowledge of IP67/NEMA ratings for potential edge or outdoor deployment variants
• Experience with vibration/shock testing per ISTA 3-series or GR-63-CORE

ONSITE:

This position is required to work onsite 5 days per week to meet the minimum essential duties and requirements of this position. As an on-site R&D and manufacturing operations organization, in-person face to face interaction is essential to building authentic relationships, trust, teamwork, and collaboration.

Compensation & Benefits:

Expected salary range for this role is from $136,700 to $208,500, and a final salary will be determined by the candidate's experience and educational background. QuantumScape also offers an annual bonus and a generous RSU/Equity package as part of its compensation plan. In addition, we do offer a tremendous benefits plan including employee paid health care, Employee Stock Purchase Plan (ESPP), and other benefits.

We are an equal opportunity employer and value diversity at our company. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status.

We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive benefits and privileges of employment. Please contact us to request an accommodation.