Thermal Design & Validation Engineer

AMD; Secaucus (NJ); On-site; USD 120,000 - 180,000; Full time

Job summary

AMD is seeking a Thermal Design & Validation Engineer in the Data Center Platform Engineering team to design, simulate, validate, and qualify liquid cooling for AI and data center GPU products. You will work on cold plates, liquid cooling architecture, and thermal‑mechanical analysis with cross‑functional teams worldwide.

You will run CFD with Icepak or similar, perform 1D flow modeling, plan lab validation, correlate data with simulations, and drive root‑cause resolution for thermal and

Qualifications

• Heat transfer, fluid mechanics, and electronics cooling; experience validating liquid cooling for high‑power electronics—ideally AI, HPC, or Data Center server platforms.
• Cold plate design and thermal interface management; manufacturing processes such as machining, brazing, skiving, friction stir welding, and additive manufacturing.
• BS, MS, or PhD in Mechanical Engineering or related discipline.

Responsibilities

• Design and develop cold plates and liquid cooling components for AMD Data Center GPU platforms; drive hardware development from concept through validation and production release.
• Run CFD simulations (Icepak or equivalent) and 1D flow network models to optimize thermal performance, coolant distribution, pressure drop, and flow balance at component, server, and rack level.
• Perform thermal‑mechanical analysis of cold plate assemblies—mounting load, tolerance stack‑up, flatness, warpage, and interface contact.
• Plan and execute validation for cold plates, manifolds, tubing assemblies, and full liquid cooling systems, including flow, pressure drop, thermal resistance, leak, and reliability testing.
• Correlate test data with simulation, identify design optimisations, and drive root‑cause actions for thermal, mechanical, and manufacturing issues.
• Communicate results through technical reports and design reviews.

Skills

Liquid cooling systems

Electronics thermal management

CFD

1D flow network modelling

FEA

Root-cause analysis

Education

BS/MS/PhD in Mechanical Engineering

Tools

Creo

SolidWorks

Icepak

FloTHERM

Ansys Fluent

Python

MATLAB

LabVIEW

Job description

At AMD, our mission is to build great products that accelerate next‑generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond.

The Role

As a Thermal Design & Validation Engineer in the Data Center Platform Engineering (DPEG) Thermal Mechanical Engineering team, you will design, simulate, validate, and qualify liquid cooling solutions for AMD's next‑generation AI and Data Center GPU products. Spanning cold plate design, liquid cooling architecture, thermal‑mechanical analysis, CFD simulation, and lab validation, you'll partner with thermal architects, package and board designers, system engineers, manufacturing, and external suppliers to deliver high‑performance, reliable, and manufacturable cooling solutions from concept through production.

The Person

You are a hands‑on technical contributor with expertise in liquid cooling systems and electronics thermal management, and a passion for solving complex thermal‑mechanical challenges. A self‑motivated problem solver with strong analytical, troubleshooting, and root‑cause skills, you thrive in a fast‑paced product development environment and communicate and collaborate effectively across global teams.

Key Responsibilities

• Design and develop cold plates and liquid cooling components for AMD Data Center GPU platforms, driving hardware development from concept through validation and production release.
• Run CFD simulations (Icepak or equivalent) and 1D flow network models to optimize thermal performance, coolant distribution, pressure drop, and flow balance at component, server, and rack level.
• Perform thermal‑mechanical analysis of cold plate assemblies—mounting load, tolerance stack‑up, flatness, warpage, and interface contact—to ensure performance and reliability.
• Plan and execute validation for cold plates, manifolds, tubing assemblies, and full liquid cooling systems, including flow, pressure drop, thermal resistance, leak, and reliability testing.
• Correlate test data with simulation, identify design optimisations, and drive root‑cause analysis and corrective actions for thermal, mechanical, and manufacturing issues.
• Communicate results through technical reports and design reviews.

Preferred Experience

Domain Expertise

• Heat transfer, fluid mechanics, and electronics cooling, with experience validating liquid cooling for high‑power electronics—ideally AI, HPC, or Data Center server platforms.
• Cold plate design and thermal interface management, including manufacturing processes such as machining, brazing, skiving, friction stir welding, and additive manufacturing.

Simulation & Modeling

• CFD analysis with Icepak, FloTHERM, Ansys Fluent, or similar tools.
• 1D flow network modelling, with a strong grasp of pressure drop, flow distribution, and coolant performance optimisation.
• FEA for structural and thermo‑mechanical analysis, plus GD&T, manufacturing tolerances, and assembly processes.

Validation & Lab

• Thermal and mechanical validation of cold plates and rack‑level cooling systems, including lab instrumentation, telemetry, data acquisition, and analysis.
• Lead end‑to‑end liquid cooling validation, including thermal, hydraulic, leak, and qualification testing to support product release.

Tools & Programming

• Proficiency with CAD software (Creo and/or SolidWorks).
• Python, MATLAB, LabVIEW, or similar tools for automation, data analysis, DOE, and statistical methods.
• Strong problem‑solving, debugging, and root‑cause skills, with familiarity in OCP and modern liquid‑cooled AI infrastructure.

Academic Credentials

• BS, MS, or PhD in Mechanical Engineering or related discipline.

This role is not eligible for visa sponsorship.

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee‑based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third‑party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.