Test and Reliability Leader

Lyte AI Inc.; Sunnyvale (CA); On-site; USD 150,000 - 230,000; Full time

Benefits offered by this job

Competitive salary and equity

Comprehensive medical, dental, and vision coverage

Flexible vacation and time-off policy

Collaborative, fast-paced, and inclusive work environment

Opportunity to work on cutting-edge technologies

Job summary

A technology company in robotics, headquartered in Sunnyvale, CA, is seeking a Process Lead Engineer with a strong background in mechanical engineering and optical device packaging. The ideal candidate will lead assembly processes, support R&D, and manage projects while ensuring quality and improvement across operations. This role offers competitive pay between $150,000 and $230,000 annually, comprehensive benefits, and opportunities to work on cutting-edge technologies.

Qualifications

• Mechanical engineering degree with experience in optical module assembly.
• 3+ years of relevant experience required for Master's or Ph.D. holders.
• Knowledge of optical device packaging processes essential.
• Proficiency in mechanical simulations and drawings required.
• Ability to work independently and collaboratively is crucial.
• Strong project management skills and work ethic.

Responsibilities

• Lead optical engine and system module assembly.
• Support device packaging R&D and NPI.
• Act as technical project manager for owned projects.
• Provide DFM, DFR, and DFT inputs.
• Audit and report on contract manufacturers and suppliers.

Skills

Mechanical Engineering

Optical module assembly

Project management

SolidWorks

Process improvement

Supplier quality management

Optical sensors

PCBA knowledge

Education

Master's or Ph.D. in Mechanical Engineering or related field

Tools

SolidWorks

Job description

• We areseekingan experienced process lead engineer in the field of optical device packaging andassembly withadegree inMechanical Engineering, Physics or a related field.

What you'll do

• Lead optical engine and system module assembly with automation and tooling designs to increase UPH & yield and reduce cost with both customized hardware and software development based on SPC and drive Cp, Cpk improvement.
• Support the device packaging RnD and NPI with mechanical design, drawing and thermal modelling.
• Support device testing automation and data analysis automation/scripts or software development and implementation.
• Work with RnD to understand the device specs, particularly mechanical control outline, and assembly requirements and negotiate between the incoming device MCO, mechanical design, and assembly process based on design improvement and/or experimental data from designed DOEs.
• Work with OSATs to support NPI and volume production contract manufacture with technical SOW drafting.
• Act as the technical project manager for owned projects.
• Provide DFM, DFR, and DFT inputs for HQ RnD teams for device packaging and assembly.
• Keep proper documentation, and initiate ECN and PCN when needed.
• Develop and track packaging and assembly component specifications as well as inventory.
• Audit/regularly visit our contract Manufacturers and suppliers then provide reports.
• Write technical reports and present results to internal and external stakeholders.
• Build and grow the Operation Process Team worldwide.

Required Qualifications

• Have a mechanical engineer degree with relevant experience on optical module and/or Lider assembly.
• Minimal requirement is a Master or Ph.D. degree with 3 years of relevant experience.
• Experience or knowledge of optical sensors. optical device packaging process, or optical module assembly process.
• Experience with assembly process integration for process flow design and continue process improvement.
• Expertise mechanical drawings using SolidWork, mechanical simulation, and thermal simulation.
• Project management capability/experience is a must.
• Experience working with foundries, OSATs, assembly houses, PCBA fab, and contract manufacturers in process development and yield improvement is important.
• The ability to work independently and take ownership of projects as well as collaboratively in cross-functional teams is a must.
• A fast learner is a must.
• Good work ethics is a must
• Capable of keeping company confidential information and IP is a must.

Preferred Qualifications

• Knowledge or work experience with PCBA is highly desirable.
• Former experience of microelectronic and optical devices packaging is desired.
• Understanding Silicon Photonics is a plus.
• Experience with FMEA, failure analysis, and 8D report is highly desired.
• Supplier quality management experience is a plus.
• Knowledge of Lidar and relevant technologies is a plus.
• Former experience of writing technical SoW is a plus.
• Familiar with ECN, PCN, and documentation is highly desirable.
• Competitive salary and equity
• Comprehensive medical, dental, and vision coverage
• Flexible vacation and time-off policy
• Collaborative, fast-paced, and inclusive work environment
• Opportunity to work oncutting-edgetechnologies with a highly cross-functional team

About Lyte

Lyte buildsperceptionsystems for Physical AIoperatingin complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

Ifyou’reexcited about building impactful technology in a dynamic, hands-on environment,we’dlove to hear from you!

The pay range for this role is:

150,000 - 230,000 USD per year (Bay Area, CA)