Summer Software Engineer Intern — Relocation Covered

QUALCOMM, Inc.; United States; Remote; USD 23,000 - 135,000; Full time

Benefits offered by this job

Relocation coverage

Furnished housing accommodations

Accrued vacation time

Competitive hourly pay

Job summary

Qualcomm Technologies, Inc. invites aspiring software engineers to join the Summer 2027 internship program. You will work on developing and maintaining software for wireless devices, aligned with the Software Engineering track, and matched to projects based on your resume.

You will collaborate with world-class engineers, receive mentorship, and gain hands-on experience in the software development lifecycle while leveraging C, C++, and Python skills on real-world Qualcomm technologies.

Qualifications

• Currently enrolled in a bachelor’s or master’s degree program in computer engineering, computer science, electrical engineering, or a related field.
• Available for 11–14 weeks during Summer 2027 (May–September).
• Expected graduation date of November 2027 or later.
• 1+ years of academic experience with programming languages such as C, C++, or Python.

Skills

C

C++

Python

Education

Bachelor's/Master's in CS/EE/CE

Tools

Linux

Job description

Qualcomm Technologies, Inc. invites aspiring software engineers to join the Summer 2027 internship program. You will work on developing and maintaining software for wireless devices, aligned with the Software Engineering track, and matched to projects based on your resume.

You will collaborate with world-class engineers, receive mentorship, and gain hands-on experience in the software development lifecycle while leveraging C, C++, and Python skills on real-world Qualcomm technologies.