Staff/Principal Thermal Engineer

Xscape Photonics Inc

California (MO)

On-site

USD 150,000 - 210,000

Full time

8 days ago
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Benefits offered by this job

Competitive salary
Equity"
Medical insurance
401(k) match

Job summary

Xscape Photonics Inc in Santa Clara, CA seeks a Staff or Principal Thermal Engineer to own thermal architecture across photonic and electronic systems from concept to production.

The role emphasizes high ownership, development of cooling solutions (TECs, TIMs, heat sinks, air and liquid cooling), CFD analysis, and collaboration with multiple teams while mentoring junior engineers.

Qualifications

  • Master's or PhD in Mechanical or Aerospace Engineering with heat transfer focus.
  • 8+ years of thermal engineering for Staff, 12+ for Principal (or equivalent).
  • Proven track record delivering cooling solutions (TECs, TIMs, heat sinks) and thermal hardware.
  • Deep CFD expertise and setting simulation strategy, not just running models.

Responsibilities

  • Own thermal architecture and strategy for photonic modules across programs from concept to production.
  • Lead design of cooling solutions: TECs, TIMs, heat spreaders/ sinks; air and liquid cooling.
  • Define and drive CFD analysis strategy and thermal test validation plan.
  • Mentor junior engineers and collaborate across optical, mechanical, electrical, packaging, firmware, reliability teams.

Skills

Thermal Design
CFD Simulation
Thermal Testing
Technical Leadership
Cross-functional Collaboration

Education

Master's or PhD in Mechanical Engineering or Aerospace Engineering

Tools

Ansys Icepak/Fluent
LabVIEW/DAQ Systems
IR Imaging

Job description

Xscape Photonics is a cutting-edge technology company developing advanced photonic systems for high-

performance computing and communication applications. Our work focuses on enabling next-generation

optical interconnects through innovative integration of photonics, electronics, and packaging technologies.

We are building highly efficient, scalable solutions where thermal management plays a critical role in

performance, reliability, and product success.

We are seeking a Staff or Principal Thermal Engineer to own thermal architecture, performance, and

strategy for our photonic and electronic systems — from early concept through production. This is a high-

ownership role: you will set the thermal design direction across programs, own module thermal

performance against target temperature and crosstalk limits, lead the development of cooling solutions

(TECs, TIMs, heat spreaders/heat sinks, air and liquid cooling), drive simulation and validation

methodology, and own thermal-related failure analysis. You will represent thermal engineering in

customer- and leadership-facing technical reviews, work closely with optical, mechanical, electrical,

packaging, firmware, and reliability engineers, and mentor and guide other thermal engineers as the team

Key Responsibilities
Thermal Design & Analysis
  • Own thermal architecture and strategy for photonic modules and systems across multiple programs, from concept through production
  • Lead design and development of cooling solutions using:
    • Thermoelectric coolers (TECs)
    • Thermal interface materials (TIMs)
    • Heat spreaders and heat sinks
    • Air cooling and liquid cooling approaches
  • Perform thermal trade-off analysis across candidate designs, evaluating cost, power consumption, and mechanical and electrical complexity to guide architecture decisions
  • Lead critical cooling-technology, material, and supplier decisions (TECs, TIMs, cooling solutions), balancing product performance, cost structure, and long-term scalability
  • Set thermal simulation methodology and standards; drive CFD analysis strategy (temperature distribution, heat flow, thermal crosstalk) and review the work of other engineers
  • Define and own the thermal test and validation strategy, including instrumentation (thermocouples, IR imaging, DAQ/LabVIEW) and test-to-simulation correlation
Thermal Failure Analysis
  • Own thermal-related failure analysis, working closely with the Lead FA Engineer on the overall FA process
  • Diagnose thermal-stack failure modes such as TIM pump-out and dry-out, solder void growth, bond-line degradation, TEC fatigue over thermal cycling, and warpage-driven loss of contact
  • Apply thermal FA diagnostic techniques — IR/lock-in thermography for hot-spot localization, thermal transient testing and structure-function analysis, and coordination of CT/acoustic
  • Feed FA findings back into design margin, TIM/material selection, and thermal qualification criteria to prevent recurrence
Cross-Functional Leadership
  • Own accountability for module thermal performance against targets — define the thermal budget, junction and case temperature limits, TEC/laser operating windows, and allowable thermal crosstalk, and hold the design to them from prototype through production and across the product's operating life
  • Own thermal integrity of the system, including thermal runaway prevention, heat-path optimization, and definition and enforcement of worst-case operating margins and guard-bands across environmental and use-case variations
  • Represent thermal engineering in customer and executive/leadership reviews; present thermal compliance, risk, and trade-offs at program milestones
  • Partner with mechanical, PCB, and packaging engineering to integrate thermal requirements early in design
  • Support new product introduction (NPI) and transfer to manufacturing, including design for manufacturability and production ramp — working with contract manufacturers and assembly teams on TIM application, reflow, and thermal-stack assembly processes to ensure thermal performance holds in volume production
  • Mentor and provide technical guidance to junior and mid-level thermal engineers; may directly or indirectly lead a small thermal team as it scales
  • Own thermal risk assessment, design reviews, and technical documentation across programs
Required Qualifications
  • Master's or PhD in Mechanical Engineering, Aerospace Engineering, or a related field, with a focus on heat transfer and fluid mechanics
  • 8+ years of thermal engineering experience for Staff, or 12+ years for Principal (PhD + 5+ years of industry experience may be considered equivalent to MS + 8+ years for Staff-level scope)
  • Demonstrated track record designing and delivering cooling solutions using TECs, TIMs, heat spreaders/heat sinks, and air and liquid cooling
  • Deep CFD simulation expertise (e.g., Ansys Icepak/Fluent, Ansys Mechanical, or equivalent) with a record of setting simulation strategy, not only executing models
  • Extensive hands-on thermal test and validation experience (IR imaging, thermocouples, DAQ systems) with demonstrated test-to-simulation correlation
  • Demonstrated root-cause problem solving and thermal failure analysis, including experience diagnosing thermal-stack failure modes and applying thermal diagnostic techniques (e.g., IR/lock-in thermography, thermal transient testing)
  • Experience owning thermal architecture at the system or program level, not solely at the
  • Strong teamwork and cross-functional collaboration skills, with the ability to work effectively alongside optical, mechanical, electrical, packaging, firmware, and reliability engineers
  • Excellent written and verbal communication skills, including the ability to present complex thermal analyses and trade-offs clearly to both technical and non-technical audiences
  • This is a full-time, on-site role based in Santa Clara, CA
Preferred Skills
  • Experience in photonics, optical transceivers, or high-density electronics packaging
  • Experience with vapor chamber thermal design for high power-density, space-constrained applications
  • Experience presenting thermal compliance and risk directly to customers or executive leadership
  • Prior mentorship or direct/indirect leadership of other thermal engineers
  • Programming and data analysis skills (Python, MATLAB) for test automation and data processing
  • Experience with qualification/certification test campaigns and thermal reliability of materials and interfaces
What We Offer
  • Ownership of thermal strategy on advanced photonics systems at the ground floor of a fast- scaling startup
  • Collaborative and innovative work environment with direct access to leadership
  • Competitive salary, equity, and benefits
  • Career growth in a rapidly evolving technology space
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