Staff Memory Design Engineer, HBM

Micron Technology

Richardson (TX)

On-site

USD 120,000 - 180,000

Full time

2 days ago
Be an early applicant
Application generator

Get a reply from this employer — a resume and cover letter tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Medical/Dental/Vision
Paid time off
Paid holidays
Retirement plans

Job summary

Micron Technology is seeking a Staff Design Engineer to design, simulate and optimize DRAM circuits, collaborating with global teams to deliver manufacturable, high‑quality memory products. You will drive innovation in future memory generations and contribute to silicon‑to‑system development.

The role emphasizes CMOS circuit design, verification, and layout leadership, with responsibilities spanning schematic edits, floorplanning, and design reviews to ensure performance and cost efficiency.

Qualifications

  • Design of digital, analog and memory core circuits per device specs.
  • Experience simulating with FINESIM, HSPICE and VERILOG.
  • Cross‑functional collaboration to ensure manufacturability and quality.

Responsibilities

  • Design digital, analog and memory core circuits from concept to solution.
  • Use AI‑enabled tools for schematic editing and layout floorplanning.
  • Lead design reviews and document design decisions.

Skills

CMOS Circuit Design
VLSI
Cadence Virtuoso
HSPICE & VERILOG

Education

BS in Electrical Engineering
MS in Electrical Engineering

Tools

FINESIM

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment.

Responsibilities
  • Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.
  • Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan.
  • Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.
  • Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.
  • Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.
  • Prepare and maintain design documentation while contributing to best‑known practices and departmental training.
  • Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.
  • Manage layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.
  • Prepare project status reports and lead design reviews to communicate progress and technical decisions.
Qualifications
  • Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.
  • Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.
  • Strong analytical and problem‑solving skills with proven significant technical contributions and a record of innovation.
  • Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience.
  • Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market.
Preferred Qualifications
  • Self‑motivated with strong problem‑solving abilities and a drive to discover new solutions.
  • Deep knowledge of industry‑specific technologies and competitive trends.
  • Excellent communication and interpersonal skills for cross‑functional collaboration.
  • BS or MS in Electrical Engineering or related field plus 6 years of experience in DRAM design, product, or system.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.

  • Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
  • We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
  • Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
  • Additionally, Micron benefits include a robust paid time-off program and paid holidays.
  • For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Staff Memory Design Engineer, HBM
Staff Memory Design Engineer, HBM

1000 Micron Technology, Inc. • Richardson (TX)

On-site
USD 150,000 - 210,000
Medical Plan
Dental Plan
Vision Plan
+1
Staff Memory Design Engineer, HBM
Staff Memory Design Engineer, HBM

Micron Technology, Inc. • Richardson (TX)

On-site
USD 140,000 - 190,000
Medical plans
Dental plans
Vision plans
+2
New College Grad - Design Engineer, HBM
New College Grad - Design Engineer, HBM

Micron Technology • Nebraska

On-site
USD 120,000 - 170,000
Medical, dental and vision plans
Paid time off
Paid holidays
+1
Staff Memory Design Engineer, HBM
Staff Memory Design Engineer, HBM

Micron Technology • Nebraska

On-site
USD 140,000 - 200,000
Medical, dental & vision plans
Paid time off & holidays
Retirement/401(k)
+1
Senior Memory Design Engineer, HBM
Senior Memory Design Engineer, HBM

Micron Technology • Richardson (TX)

On-site
USD 140,000 - 190,000
Medical/Dental/Vision plans
Paid time off & holidays
Retirement benefits (401k)
Staff Design Engineer, DRAM
Staff Design Engineer, DRAM

Micron Technology • Boise (ID)

On-site
USD 120,000 - 180,000
New College Grad - Semiconductor Design Engineer
New College Grad - Semiconductor Design Engineer

Micron Technology • Boise (ID)

On-site
USD 120,000 - 180,000
Medical, dental, vision plans
Paid time off
Paid holidays
Senior Design Engineer, HBM
Senior Design Engineer, HBM

Micron Technology, Inc • Richardson (TX)

On-site
USD 120,000 - 160,000
Medical/Dental/Vision
Paid time off
Paid holidays
Staff Design Engineer, DRAM
Staff Design Engineer, DRAM

Micron • Boise (ID)

On-site
USD 150,000 - 190,000
Staff DRAM Design Engineer
Staff DRAM Design Engineer

Micron • Boise (ID)

On-site
USD 120,000 - 170,000
Medical, dental and vision plans
Paid time-off program
Paid holidays