Staff Engineer, HBM Test Vehicle Design

Micron Technology; Nebraska; On-site; USD 140,000 - 190,000; Full time

Job summary

Micron Technology is seeking a Staff Engineer to lead the design and development of test vehicles enabling learning and risk reduction for future HBM products. The role partners with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate requirements into actionable test structures and validation strategies.

Responsibilities include leading test-vehicle content, analyzing silicon characterization results, and driving cross-functional

Qualifications

• Master’s degree (or PhD) in Electrical Engineering, Computer Engineering, Materials Science, Physics or related field.
• 5+ years of semiconductor experience in design, product engineering, packaging, technology development, or related areas.
• Strong understanding of semiconductor design and physical implementation fundamentals.
• Experience with silicon validation, characterization, data analysis, or failure investigation.
• Proven ability to work effectively across multiple engineering organizations.
• Proficiency with demonstrating AI and AI-enabled development workflows.

Responsibilities

• Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team.
• Define and implement test structures targeting key learning areas such as package interaction and reliability.
• Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives.
• Analyze silicon characterization and qualification results to identify optimization opportunities and communicate actionable recommendations to Design, Product, and Technology Development teams.
• Support development of product-enveloping experimental vehicles that improve learning and enable reuse across multiple HBM programs.
• Lead technical investigations to understand design, process, and package interactions impacting product performance, reliability, and manufacturability.
• Participate in multi-functional reviews and provide technical recommendations to guide future test vehicle content and priorities.
• Contribute to development of design guidelines, protocols, and lessons learned that improve future product and technology development.

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products!

This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions.

You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations.

Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures.

Key Responsibilities

• Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team.
• Define and implement test structures targeting key learning areas such as package interaction and reliability
• Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives.
• Analyze silicon characterization and qualification results to identify optimization opportunities and communicate actionable recommendations to Design, Product, and Technology Development teams.
• Support development of product-enveloping experimental vehicles that improve learning and enable reuse across multiple HBM programs.
• Lead technical investigations to understand design, process, and package interactions impacting product performance, reliability, and manufacturability.
• Participate in multi-functional reviews and provide technical recommendations to guide future test vehicle content and priorities.
• Contribute to development of design guidelines, protocols, and lessons learned that improve future product and technology development.

Minimum Qualifications

• Master’s degree or PhD in Electrical Engineering, Computer Engineering, Materials Science, Physics, or related field.
• 5+ years of semiconductor experience in design, product engineering, packaging, technology development, or related subject areas.
• Strong understanding of semiconductor design and physical implementation fundamentals.
• Experience with silicon validation, characterization, data analysis, or failure investigation.
• Proven ability to work effectively across multiple engineering organizations.
• Proficiency with demonstrating AI and AI-enabled development workflows.

Preferred Qualifications

• Experience with HBM, DRAM, or advanced memory products.
• Experience designing test structures, test chips, characterization vehicles, or technology demonstrators.
• Knowledge of advanced packaging technologies including TSVs, hybrid bonding, and 3D integration.
• Understanding of reliability qualification methodologies and failure mechanisms.
• Experience using silicon learning to influence future design or technology decisions.
• Strong written and verbal communication skills with the ability to present technical findings to diverse engineering audiences.

Why This Role Matters

Test vehicles are a critical mechanism for identifying technology, design, and integration risks before they impact product development. This role enables Micron to generate actionable learning earlier in the development cycle, improving design quality, reducing program risk, and accelerating innovation across future HBM generations.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.