Sr Staff Wafer Metrology Integration Lead Engineer

Seagate Technology; BLOOMINGTON (MN); On-site; USD 133,000 - 194,000; Full time

Benefits offered by this job

Discretionary bonus

Medical insurance

Dental insurance

Vision insurance

401(k)

Employee stock purchase plan

Health savings account

Paid time off

Job summary

Seagate Technology is seeking a Wafer Metrology and Control Integration Technical Lead in Bloomington, MN. You will guide metrology for wafer characterization and process control across HAMR/ATD teams, driving cross-functional efforts from development through production in a cleanroom environment.

The role requires strong analytical, leadership, and communication skills with 5+ years in thin film research or related tech fields.

Qualifications

• Minimum 5+ years relevant experience in thin film related research or technology industry.
• Intimate knowledge of measurement techniques for nanotechnology device fabrication.
• Experience with data analysis and statistical analysis.

Responsibilities

• Understand new process flows and product builds and how these affect metrology and test performance.
• Leverage learning about current control methods to identify opportunities for innovation and improvement.
• Establish metrology roadmaps and identify critical gaps in product and material characterization.
• Lead cross-functional teams to close metrology gaps with process, design, metrology, and product groups.
• Advocate for metrology requests and manage priorities with stakeholders.
• Develop robust measurement processes on new transducer processes and designs.
• Lead projects to improve the effectiveness of process control methods across the head supply chain.
• Document measurement and control methods at transfer readiness checkpoints and contribute to roadmaps.

Skills

Analytical skills

Leadership

Communication skills

Project management

Education

BS in Physics / Materials Science / Electrical / Chemical Engineering (12+ years)

Job description

About Our Group

Do you want to work on cutting edge technology that pushes the limits of what a whole industry can do? You will have the exciting opportunity to help push the areal density of Seagate recording heads beyond that of any other competitor in the world. This is a Wafer Metrology and Control Integration Technical Lead position in our wafer process engineering metrology team and works closely with our HAMR and ATD process development teams. Our team's mission is to develop and implement metrology for wafer characterization and process control for state of the art recording technology. Recording head process technology encompasses all disciplines employed in semiconductor wafer processing, performed in a clean room environment.

About Our Group

Do you want to work on cutting edge technology that pushes the limits of what a whole industry can do? You will have the exciting opportunity to help push the areal density of Seagate recording heads beyond that of any other competitor in the world. This is a Wafer Metrology and Control Integration Technical Lead position in our wafer process engineering metrology team and works closely with our HAMR and ATD process development teams. Our team's mission is to develop and implement metrology for wafer characterization and process control for state of the art recording technology. Recording head process technology encompasses all disciplines employed in semiconductor wafer processing, performed in a clean room environment.

About The Role - You Will

• Understand new process flows and product builds and how these can affect metrology and test performance.
• Leverage learning about current control methods earlier in development and looking for opportunities for innovation and improvement.
• Establish product and material characterization metrology roadmaps and identify critical gaps.
• Work with various process, design, metrology, product teams to drive closure of metrology gaps.
• Being an advocate for Metrology and Test requests and their priority in the overall workflow.
• Secure commitments on priorities and timelines for gap closure from relevant stakeholders.
• Work with metrology and process owners to identify and develop robust, accurate measurement processes on new transducer processes and designs.
• Lead cross-functional projects to assess and improve the effectiveness and efficiency of our process control methods through innovative combinations of measurements and factory control systems across the head supply chain from wafer to HGSA.
• Document the expected measurement and control methods at the product or process transfer readiness checkpoints between development, integration and process engineering. This includes preparing process control flow diagrams as well as input into Metrology and Factory Control Systems roadmaps and the Wafer Route Content Standards.
• Ensure cross-site and cross-functional collaboration towards successful implementation of the documented control plans and measurement content standards across both wafer sites.

About You

• Minimum 5+ years relevant experience in thin film related research or technology industry.
• Requires intimate knowledge of measurement techniques used in nanotechnology device fabrication for characterization and manufacturing control.
• Requires experience with data analysis applications and statistical analysis.

Your Experience Includes

• Ability to lead multidisciplinary projects outside of his/her nominal area of expertise.
• Ability to identify opportunities and gaps and develop and execute team plans to deliver solutions with minimal management guidance.
• Strong analytical skills.
• Strong leadership and communication skills.
• Strong documentation skills.
• BS degree in Physics, Materials Science, Electrical Engineering, Chemical Engineering or other relevant field with 12+ years of experience, MS degree with 8+ years of experience or PhD degree with 5+ years of experience

You Might Also Have

• Ability to deal with shifting priorities between stakeholders across functional boundaries.
• Additional experience in one or more of the following areas: mask design, thin film deposition, ion Milling, ICP etch, plating, CMP, photolithography, design, and wafer metrologies will also be considered.

Location:

Our Normandale campus spans two suburbs, Edina and Bloomington, and serves as the Recording Head development and manufacturing arm of Seagate. Located in the heart of a bustling community, Seagate offers an on-site café, or if you prefer, you can drive to one of many restaurants just minutes away. Need to grab a gift over lunch time? Shopping is abundant in the area. If working out is your thing, the on-site fully equipped fitness center hosts wellness programs, outdoor activities, tournaments and group workouts. Looking for something more laid back? Reset in one of our meditation rooms, or simply take a walk around our indoor walking path. On-site cultural festivals, celebrations and community volunteer opportunities also abound.

The estimated base salary range for this position is $132,974.40 - $193,814.40. The individual salary is based on work location and additional factors, including job-related skills, experience, and relevant education or training.

Seagate offers comprehensive benefits to its eligible employees, including, but not limited to, eligibility to participate in discretionary bonus program, medical, dental, vision, and life insurance, short-and long-term disability, 401(k), employee stock purchase plan, health savings account, dependent care, and healthcare spending accounts. Seagate also offers paid time off, including 12 holidays, flexible time off provided pursuant to Seagate policy, a minimum of 48 hours of paid sick leave, and 16 weeks of paid parental leave. The benefits for this position are based on a full-time schedule for a full calendar year and may differ depending on work location.

Location: Normandale, United States

Travel

Up to 10%