Sr Staff Package Design Engineer

Renesas Electronics; Tempe (AZ); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Flexible work environment

Employee Resource Groups

Career advancement opportunities

Job summary

A leading semiconductor solutions provider in Tempe, Arizona is seeking an experienced engineer to design and develop packaging methods for various applications, including automotive and industrial power. The ideal candidate must possess a relevant degree and 10-15 years of experience in package development, particularly in power SiP/modules. This position offers a hybrid working model, providing flexibility and opportunities for professional growth within an innovative team environment.

Qualifications

• 10-15 years of relevant experience in package development emphasizing power SiP/module and wafer level packaging.
• Strong understanding of assembly process knowledge, qualification methods, and statistical analysis software.
• Strong interpersonal and analytical skills.

Responsibilities

• Design and develop package and interconnect methods for packaging needs.
• Qualify packaging technologies for consumer and industrial power applications.
• Resolve process integration issues and ensure quality controls.

Skills

Power SiP/module packaging

Communication skills

Analytical skills

Education

Doctorate/Masters/Bachelor’s Degree in relevant engineering

Job description

• Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, flip-chip LGA, multi-chip module with substrate or embedded die/capacitor and power device packaging.
• Package technologies qualification for consumer & industrial power as well as automotive power applications.
• Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Work with OSAT/CM to develop, run DOE to optimize processes and establish process spec.
• Work with Product groups and Reliability team, qualify new packages and processes within required time frame.
• Resolve all process integration issues by ensuring all window checks are done on critical process steps.
• Establish production controls and monitor to ensure there is no room for quality incidents.
• Ensure smooth transition into production & implement ramp up monitor.
• Work with OSAT/CM to monitor and resolve process issues early in the production stage to ensure only parts with superior quality shipped to customer.
• Develop and maintain technical expertise on advances and innovations in power SiP/modules, wafer level packaging& flip chip interconnects in LGA.
• Participate in packaging roadmap development & focus on execution.
• Address internal and external customer complains working with peers of Marketing, Product groups, Quality and Operations organization to satisfy growth in businesses.

Qualifications

• Doctorate/Masters / Bachelor’s Degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
• 10-15 years of relevant experience in package development emphasizing power SiP/module, wafer level & flip-chip LGA packaging.
• Strong understanding of power SiP/modules which has an substrate or embedded die/capacitor, assembly process knowledge, qualification methods, SPC and statistical analysis software. Knowledge of Cu FSM/BGBM technologies a plus.
• Strong interpersonal and communication skills.
• Strong analytical and presentation skills.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.

With a diverse team of over 22,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘To Make Our Lives Easier.’

At Renesas, you can:

• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
• Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.
• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?

Join Renesas. Shape Your Future with Us.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to celebrating diversity and fostering a work environment free of discrimination on the of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by federal, state or local law.For more information, please read ourDiversity & Inclusion Statement .

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning.