Sr Principal Packaging Engineer

GlobalFoundries inc.; Richardson, Northern (TX, KY); Hybrid; USD 171,000 - 296,000; Full time

Job summary

GlobalFoundries inc. is seeking a Senior Principal Packaging Engineer in Richardson, TX to define the package technology roadmap and lead advanced package design for automotive and industrial applications.

You will manage OSAT partners and optimize materials, BOMs, and assembly flows to meet performance, reliability, and cost targets. Requires MS or BS in EE/ME with 15+ years in packaging, expertise in flip-chip, WLCSP and FCBGA, and hands-on use of Cadence, Synopsys, Ansys and HFSS.

Qualifications

• MS or BS EE, ME with minimum >15 yrs of experience in package design and different package technologies.
• Demonstrated expertise in package technologies and families, including flip-chip, WLCSP, and FCBGA, as well as advanced packaging architectures such as modules and chiplets.
• Hands-on experience using package- and board-level simulation tools such as Cadence, Synopsys, Ansys, and HFSS.
• Strong understanding of package assembly manufacturing flows and reliability standards.
• Demonstrated experience leading technical engagements with foundry and OSAT partners for package development, qualification, and assembly production.
• Ability to lead effectively across global, cross-disciplinary teams and communicate directly with customers, suppliers, and internal partners.
• Ability to produce clear, comprehensive product requirements, package architecture specifications, and package design documentation for internal and external audiences.

Responsibilities

• Design, develop, and implement packaging solutions that support business-unit product requirements and the package technology roadmap.
• Identify, evaluate, select package materials / BOM to meet internal quality and cost targets.
• Evaluate and optimize assembly flows and materials to drive package cost reduction, while improving overall efficiency of the process.
• Monitor packaging technology, materials, supplier capabilities, and industry best practices to benchmark competitiveness and identify opportunities for roadmap advancement.
• Develop and apply expertise across package families, including QFN, FCBGA, and WLCSP, as well as their associated assembly flows and manufacturing processes.
• Identify, engage, and qualify primary and second-source suppliers to support business continuity.
• Procure competitive quotes from 3rd party OSAT assembly houses during product planning phase.
• Conduct package co-simulation and feasibility studies—including electrical, thermal, and mechanical stress analyses—using industry-standard tools to verify that proposed packaging solutions meet product performance, reliability, and manufacturability requirements.
• Collaborate with cross-functional teams—including silicon design, reliability, package design, and assembly manufacturing—from initial concept and tape-out through qualification and high-volume production ramp.
• Lead cross-functional debugging, root-cause analysis, corrective-action implementation, and verification for package and assembly yield issues during prototype development, qualification and reliability stress testing, and high-volume production.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Skills

Package design

Cross-functional leadership

Technical engagements

Product requirements documentation

Communication with customers/suppliers

Education

MS or BS Electrical/Mechanical Engineering

Tools

Cadence

Synopsys

Ansys

HFSS

Job description

## Sr Principal Packaging EngineerApply: Richardson: Full time: Posted Today: JR-2605846This role offers the opportunity to develop industry-leading semiconductor packaging solutions for automotive and industrial applications. As a member of the New Product Development and Operations team, the Senior Principal Packaging Engineer will define the package technology roadmap, lead advanced package design and selection, optimize solutions for performance, reliability, manufacturability, and cost, and manage OSAT partners for back-end assembly and packaging.**About GlobalFoundries:**GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. **Essential Responsibilities:*** Design, develop, and implement packaging solutions that support business-unit product requirements and the package technology roadmap.* Identify, evaluate, select package materials / BOM to meet internal quality and cost targets.* Evaluate and optimize assembly flows and materials to drive package cost reduction, while improving overall efficiency of the process.* Monitor packaging technology, materials, supplier capabilities, and industry best practices to benchmark competitiveness and identify opportunities for roadmap advancement.* Develop and apply expertise across package families, including QFN, FCBGA, and WLCSP, as well as their associated assembly flows and manufacturing processes.* Identify, engage, and qualify primary and second-source suppliers to support business continuity.* Procure competitive quotes from 3rd party OSAT assembly houses during product planning phase.* Conduct package co-simulation and feasibility studies—including electrical, thermal, and mechanical stress analyses—using industry-standard tools to verify that proposed packaging solutions meet product performance, reliability, and manufacturability requirements.* Collaborate with cross-functional teams—including silicon design, reliability, package design, and assembly manufacturing—from initial concept and tape-out through qualification and high-volume production ramp.* Lead cross-functional debugging, root-cause analysis, corrective-action implementation, and verification for package and assembly yield issues during prototype development, qualification and reliability stress testing, and high-volume production.**Other Responsibilities:*** Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.**Required Qualifications:*** MS or BS EE, ME with minimum >15 yrs of experience in package design and different package technologies.* Demonstrated expertise in package technologies and families, including flip-chip, WLCSP, and FCBGA, as well as advanced packaging architectures such as modules and chiplets.* Hands-on experience using package- and board-level simulation tools such as Cadence, Synopsys, Ansys, and HFSS.* Strong understanding of package assembly manufacturing flows and reliability standards.* Demonstrated experience leading technical engagements with foundry and OSAT partners for package development, qualification, and assembly production.* Ability to lead effectively across global, cross-disciplinary teams and communicate directly with customers, suppliers, and internal partners.* Ability to produce clear, comprehensive product requirements, package architecture specifications, and package design documentation for internal and external audiences.**Expected Salary Range**$171,000.00 - $296,000.00The exact Salary will be determined based on qualifications, experience and location.If you need a reasonable accommodation for any part of the employment process, please contact us by email at [e-mail] and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.An offer with GlobalFoundries is conditioned upon the successful completion of pre-employment conditions, as applicable, and subject to applicable laws and regulations.GlobalFoundries is fully committed to equal opportunity in the workplace and believes that cultural diversity within the company enhances its business potential. GlobalFoundries goal of excellence in business necessitates the attraction and retention of highly qualified people. Artificial barriers and stereotypic biases detract from this objective and may be illegally discriminatory.All policies and processes which pertain to employees including recruitment, selection, training, utilization, promotion, compensation, benefits, extracurricular programs, and termination are created and implemented without regard to age, ethnicity, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, sexual orientation, gender identity or expression, veteran status, or any other characteristic or category specified by local, state or federal law