SR MGR R&D/PRODUCT DVL ENGINEERING

TE Connectivity Corporation; Troy (MI); Remote; USD 180,000 - 240,000; Full time

Benefits offered by this job

Health insurance

401(k)

Disability insurance

Employee stock purchase plan

Paid time off

Job summary

TE Connectivity is seeking an experienced engineering leader to manage the integrated Hardware and Signal Integrity organization for high-speed external cable assemblies. You will own the lifecycle from architecture through production release, driving DAC/ACC/AEC architectures for OSFP, QSFP-DD, and related form factors in Ethernet, AI infrastructure, and PCIe.

Based in Troy, MI, this role leads global teams across hardware, PCB design, SI/PI analysis, and validation, delivering robust, scalable

Qualifications

• BS or advanced degree in Electrical Engineering or related discipline.
• 12+ years of engineering experience with 5+ years in leadership.
• Expert in high-speed hardware, SI/PI, PCB design, and SerDes.
• Experience with OSFP, QSFP-DD, QSFP, OSFP-XD, CDFP form factors.

Responsibilities

• Lead global Hardware, PCB Design, and SI engineering teams.
• Own electrical architecture, hardware design, and verification.
• Drive ACC development using linear redriver technology, including equalization strategy.
• Drive AEC development using retimer technology, including SerDes architecture and firmware interfaces.
• Manage form-factor implementation for OSFP, QSFP-DD, QSFP, OSFP-XD, CDFP, breakouts.
• Drive products from concept and simulation through prototype bring-up, qualification, customer validation, and production release.
• Establish common design rules, simulation methodology, technical standards, design reviews, and reusable assets.
• Improve correlation among simulation, S-parameter measurements, lab characterization, and system BER/FEC performance.
• Handle root-cause investigations for complex hardware, SI, EMI, thermal, manufacturing, and customer issues.
• Partner with Product Management, IC suppliers, Firmware, Software, Validation, Manufacturing, Quality, Sourcing, and customer engineering teams.

Skills

High-speed hardware design

Signal Integrity

Power Integrity

PCB design

SerDes

Channel Modeling

Lab characterization

Education

Bachelor's degree in Electrical Engineering

Advanced degree preferred

Tools

Test equipment

Job description

Job Title: SR MGR R&D/PRODUCT DVL ENGINEERING

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.

Job Description:

Job Overview

We are seeking an experienced engineering leader to manage our integrated Hardware and Signal Integrity organization for high-speed external cable assemblies. The role owns the engineering lifecycle from architecture, simulation, hardware and PCB design through bring-up, qualification, production support, and customer issue resolution. The manager will drive passive and active copper solutions across OSFP, QSFP-DD (QDD), QSFP, OSFP-XD, CDFP, breakout, and emerging high-density form factors for Ethernet, AI infrastructure, and PCIe applications.

Technology and Product Scope

• External cable assembly platforms using OSFP, QSFP-DD (QDD), QSFP, OSFP-XD, CDFP, and future high-density form factors.
• Passive Direct Attach Copper (DAC), redriver-based Active Copper Cable (ACC), and retimer-based Active Electrical Cable (AEC) architectures.
• High-speed electrical channels supporting 112G, 224G, and future 448G and beyond lane-rate technologies, including Ethernet and PCIe applications.
• End-to-end design considerations spanning connector and paddle-card interfaces, cable performance, PCB routing, power integrity, EMI/EMC, thermal management, firmware interfaces, and system interoperability.

Job Requirements

• Lead global Hardware, PCB Design, and Signal Integrity engineering teams across passive and active external cable products.
• Own electrical architecture, hardware design, SI/PI analysis, PCB implementation, and design verification.
• Drive ACC development using linear redriver technology, including equalization strategy, power delivery, thermal performance, and link-margin optimization.
• Drive AEC development using retimer technology, including SerDes architecture, clocking, power and thermal design, device integration, firmware interfaces, and end-to-end interoperability.
• Manage form-factor implementation and design trade-offs for OSFP, QSFP-DD (QDD), QSFP, OSFP-XD, CDFP, breakouts, and new platform concepts.
• Drive products from concept and simulation through prototype bring-up, qualification, customer validation, and production release.
• Establish common design rules, simulation methodology, technical standards, design reviews, and reusable engineering assets.
• Improve correlation among simulation, S-parameter measurements, laboratory characterization, and system-level BER/FEC performance.
• Handle and support root-cause investigations for complex hardware, SI, EMI, thermal, manufacturing, and customer issues.
• Partner with Product Management, IC suppliers, Firmware, Software, Validation, Manufacturing, Quality, Sourcing, and customer engineering teams.

What your background should look like

• BS or advanced degree in Electrical Engineering or a related discipline.
• 12+ years of relevant engineering experience, including 5+ years in technical or people leadership.
• Strong expertise in high-speed hardware design, signal and power integrity, PCB design, channel modeling, S-parameters, SerDes, and laboratory characterization.
• Hands-on understanding of DAC, redriver-based ACC, and retimer-based AEC product architectures.
• Experience with OSFP, QSFP-DD, QSFP, OSFP-XD, CDFP, or comparable high-speed pluggable and cabled I/O form factors.
• Experience spear heading complex products from architecture through qualification and production, preferably within Ethernet, AI infrastructure, networking, or PCIe ecosystems.
• Demonstrated ability to lead global teams and work across engineering, operations, suppliers, and customer-facing organizations.

#TANAUV #LI-REMOTE

Competencies

SET : Strategy, Execution, Talent (for managers)

ABOUT TE CONNECTIVITY

TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. As a trusted innovation partner, our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers enabling artificial intelligence, and more.

COMPENSATION

• Competitive base salary commensurate with experience: $180,000 – $240,000 (subject to change dependent on physical location)
• Posted salary ranges are made in good faith. TE Connectivity reserves the right to adjust ranges depending on the experience/qualification of the selected candidate as well as internal and external equity.
• Total Compensation = Base Salary + Incentive(s) + Benefits

BENEFITS

• A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.

EOE, Including Disability/Vets

Job Locations:

Posting City: Troy

Job Country: United States

Travel Required: 10% to 25%

Requisition ID: 159968

Workplace Type: Remote

External Careers Page: Engineering & Technology