Sr Manager Package SIPI, Annapurna Labs

Annapurna Labs; Austin (TX); Sur place; USD 241 000 - 326 000; Plein temps

Résumé du poste

Annapurna Labs in Austin, TX seeks a Senior Manager of Package Signal & Power Integrity to lead a small SI/PI team and set the technical direction for 2.5D/3D packaging platforms including CoWoS and EMIB. You will remain hands-on with modeling, simulation, and post-silicon correlation while owning the SI/PI strategy from architecture to production.

The role requires 12+ years in SI/PI within semiconductor packaging, with 3+ years of people management, and strong proficiency in 2.5D/3D packaging,

Qualifications

• MS or PhD in Electrical Engineering, with emphasis in electromagnetics, signal integrity, power integrity, or microelectronics.
• 12+ years of progressive SI/PI engineering experience in semiconductor packaging (IC package, interposer, or substrate design).
• 3+ years of direct people-management experience leading SI/PI or packaging engineering teams.
• Demonstrated expertise in 2.5D/3D advanced packaging technologies (CoWoS-S/L/R, EMIB, Foveros, 3D die stacking, TSV, RDL).
• Hands-on experience with SI/PI analysis for high-speed SerDes interfaces at 56G NRZ / 112G+ PAM4 data rates.
• Strong background in HBM3/4 SI/PI design and timing budget methodology (HBM3/HBM3E/HBM4 or newer).
• Experience with PCIe Gen5/Gen6 channel design, compliance, and sign-off at the package and system level.
• Working knowledge of UCIe or comparable die-to-die interconnect standards for chiplet architectures.
• Proficiency in industry EDA/simulation tools: Ansys HFSS/SIwave/Q3D, Cadence Sigrity (PowerSI, SystemSI), Keysight ADS, HSPICE/Spectre.
• Strong scripting skills (Python, MATLAB, Tcl) for simulation automation and data analysis.
• Proven ability to drive cross-functional alignment across silicon, package, board, and system teams in a fast-paced product environment.

Responsabilités

• Lead and develop a team of SI/PI engineers, setting priorities, driving career growth, and building world-class packaging expertise.
• Define and execute SI/PI design methodology for 2.5D/3D IC packages—including silicon interposer, RDL, TSV, and bridge-based architectures.
• Drive chip-package-system co-design by performing end-to-end SI/PI analysis and optimization for HBM (HBM3/HBM3E+), PCIe Gen5/Gen6/Gen7, UCIe die-to-die interconnects and high-speed SerDes (112G+/224G PAM4).
• Own PDN design and sign-off across die, interposer, package substrate, and PCB, including AC/DC/transient droop analysis and decoupling strategy.
• Develop and validate channel models (S-parameter, IBIS-AMI) and perform BER/eye-diagram analysis for multi-lane high-speed links.
• Establish SI/PI design guidelines, sign-off criteria, and automation flows; drive continuous improvement in accuracy and productivity.
• Partner with ASIC architects, PHY/IP teams, package layout, thermal/mechanical, PCB, and system design teams to close electrical specifications.
• Collaborate with other internal partners and external partners (possible like foundry, OSAT, and substrate suppliers etc.) on technology assessment, DFM trade-offs, and new package platform enablement.
• Lead post-silicon validation and model-to-hardware correlation using VNA, TDR, oscilloscope, and spectrum analyzer measurements.

Connaissances

Team leadership

2.5D/3D packaging

HBM/PI/PCIe

Scripting (Python/MATLAB/Tcl)

Cross-functional collaboration

Modeling/simulation

Formation

MS/PhD in Electrical Engineering

Outils

Ansys HFSS/SIwave/SystemSI

Cadence Sigrity

Keysight ADS

HSPICE/Spectre

Description du poste

Description

About the Role

We are looking for a Senior Manager of Package Signal & Power Integrity to lead a small team of engineers delivering SI/PI solutions for next-generation 2.5D/3D chiplet-based products. This is a player-coach role: you will set the technical direction for package-level SI/PI across advanced packaging platforms (CoWoS, EMIB, 3D die stacking) while staying hands-on with modeling, simulation, and post-silicon correlation. You will own the SI/PI strategy from early architecture through high-volume production, partnering with silicon design, physical design, system architecture, and possible with OSAT/substrate vendors to ensure robust signaling and power delivery across die-to-die, memory, and high-speed SerDes interfaces.

What You Will Do

• Lead and develop a team of SI/PI engineers, setting priorities, driving career growth, and building world-class packaging expertise.
• Define and execute SI/PI design methodology for 2.5D/3D IC packages—including silicon interposer, RDL, TSV, and bridge-based architectures.
• Drive chip-package-system co-design by performing end-to-end SI/PI analysis and optimization for HBM (HBM3/HBM3E+), PCIe Gen5/Gen6/Gen7, UCIe die-to-die interconnects and high-speed SerDes (112G+/224G PAM4).
• Own PDN design and sign-off across die, interposer, package substrate, and PCB, including AC/DC/transient droop analysis and decoupling strategy.
• Develop and validate channel models (S-parameter, IBIS-AMI) and perform BER/eye-diagram analysis for multi-lane high-speed links.
• Establish SI/PI design guidelines, sign-off criteria, and automation flows; drive continuous improvement in accuracy and productivity.
• Partner with ASIC architects, PHY/IP teams, package layout, thermal/mechanical, PCB, and system design teams to close electrical specifications.
• Collaborate with other internal partners and external partners (possible like foundry, OSAT, and substrate suppliers etc.) on technology assessment, DFM trade-offs, and new package platform enablement.
• Lead post-silicon validation and model-to-hardware correlation using VNA, TDR, oscilloscope, and spectrum analyzer measurements.

Required Qualifications

• MS or PhD in Electrical Engineering, with emphasis in electromagnetics, signal integrity, power integrity, or microelectronics.
• 12+ years of progressive SI/PI engineering experience in semiconductor packaging (IC package, interposer, or substrate design).
• 3+ years of direct people-management experience leading SI/PI or packaging engineering teams.
• Demonstrated expertise in 2.5D/3D advanced packaging technologies (CoWoS-S/L/R, EMIB, Foveros, 3D die stacking, TSV, RDL, flip-chip BGA).
• Hands-on experience with SI/PI analysis for high-speed SerDes interfaces at 56G NRZ / 112G+ PAM4 data rates.
• Strong background in HBM3/4 SI/PI design and timing budget methodology (HBM3/HBM3E/HBM4 or newer).
• Experience with PCIe Gen5/Gen6 channel design, compliance, and sign-off at the package and system level.
• Working knowledge of UCIe or comparable die-to-die interconnect standards for chiplet architectures.
• Proficiency in industry EDA/simulation tools: Ansys HFSS/SIwave/Q3D, Cadence Sigrity (PowerSI, SystemSI), Keysight ADS, HSPICE/Spectre.
• Strong scripting skills (Python, MATLAB, Tcl) for simulation automation and data analysis.
• Proven ability to drive cross-functional alignment across silicon, package, board, and system teams in a fast-paced product environment.

Preferred Qualifications

• Experience with PCIe Gen7, 200G/400G Ethernet SerDes, or NVLink-class ultra-high-speed interconnects.
• Expertise in UCIe advanced (UCIe 2.0) protocol-level SI/PI considerations and latency-sensitive chiplet integration.
• Familiarity with next-generation HBM standards (HBM4e) and associated PHY/package co-design challenges.
• Track record of new product introduction (NPI) from concept through high-volume manufacturing.
• Experience with on-die EMIR/DVD analysis and chip-package PDN co-simulation workflows.
• Exposure to EMI/EMC analysis and mitigation at the package and system level.
• Knowledge of thermal-aware SI/PI design and understanding package warpage, material Dk/Df drift, and reliability impacts on signal performance.
• Experience evaluating emerging packaging platforms (glass substrate, hybrid bonding, fan-out panel-level packaging).
• Active participation in industry standards bodies (IEEE, UCIe Consortium, JEDEC, OIF).

Basic Qualifications

• Master's degree or Ph.D. degree in Electrical Engineering or related field
• Master's degree in Electrical/Communications Engineering, or 8+ years of practical semiconductor design work including full-chip and subsystem integration experience
• 3+ years of direct people management, including managing managers or senior individual contributors experience

Preferred Qualifications

• Experience with PCIe Gen7, 200G/400G Ethernet SerDes, or NVLink-class ultra-high-speed interconnects.
• Expertise in UCIe advanced (UCIe 2.0) protocol-level SI/PI considerations and latency-sensitive chiplet integration.
• Familiarity with next-generation HBM standards (HBM4e) and associated PHY/package co-design challenges.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.

Los Angeles County applicants: Job duties for this position include: work safely and cooperatively with other employees, supervisors, and staff; adhere to standards of excellence despite stressful conditions; communicate effectively and respectfully with employees, supervisors, and staff to ensure exceptional customer service; and follow all federal, state, and local laws and Company policies. Criminal history may have a direct, adverse, and negative relationship with some of the material job duties of this position. These include the duties and responsibilities listed above, as well as the abilities to adhere to company policies, exercise sound judgment, effectively manage stress and work safely and respectfully with others, exhibit trustworthiness and professionalism, and safeguard business operations and the Company’s reputation. Pursuant to the Los Angeles County Fair Chance Ordinance, we will consider for employment qualified applicants with arrest and conviction records.

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The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.

USA, CA, Cupertino - 277,400.00 - 350,000.00 USD annually

USA, TX, Austin - 241,200.00 - 325,600.00 USD annually

Company

- Annapurna Labs (U.S.) Inc.

Job ID: A10591572