Sr Manager Design Development Technical Leadership, HBM

Micron Technology, Inc.; Richardson (TX); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Competitive benefits

Relocation assistance

Paid time off

Job summary

Micron Technology, Inc. in Richardson, TX, seeks a Sr Manager Design Development Technical Leadership for HBM to lead end-to-end design build efforts.

You will coordinate cross-functional teams across design, product development, manufacturing, and partnerships to ensure on-time, quality delivery of HBM projects. Responsibilities include governance, risk management, executive reporting, and roadmap alignment with foundries and IP vendors.

Qualifications

• Bachelor’s degree in Electrical Engineering or related field.
• 10+ years of semiconductor industry experience.
• Experience leading large, cross-functional technical programs.

Responsibilities

• Lead end-to-end execution of HBM build achievements across DRAM, base die, test vehicles, interposers, IP, and sustaining development efforts.
• Drive multi-functional alignment, manage dependencies, and maintain execution plans to achieve schedule, cost, and quality objectives.
• Lead governance activities including design reviews, program reviews, risk management, and change control processes.
• Partner with foundries, IP vendors, contractors, and procurement teams to resolve execution challenges and support design delivery.
• Own roadmap communication, executive reporting, and collaborator alignment for HBM build programs.

Skills

Leadership

Cross-functional collaboration

Program management

Communication

Education

Bachelor's degree in Electrical Engineering

Job description

JR97535 Sr Manager Design Development Technical Leadership, HBM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Within Micron’s Heterogeneous Integration Group (HIG), we are driving the next generation of High Bandwidth Memory (HBM) solutions that power advanced computing and AI applications. Our team brings together experts across design, product development, manufacturing, and ecosystem partnerships to solve complex technical challenges and deliver innovative memory technologies.

The Design Development Technical Lead (DDTL) plays a critical role in enabling predictable, high-quality execution across the HBM design lifecycle. As the single-threaded technical program owner for HBM Build, you will coordinate cross-functional teams. You will manage technical dependencies and risks. You will provide clear leadership across build, product, and executive collaborators to ensure successful program delivery.

Responsibilities

• Lead end-to-end execution of HBM build achievements across DRAM, base die, test vehicles, interposers, IP, and sustaining development efforts
• Drive multi-functional alignment, manage dependencies, and maintain execution plans to achieve schedule, cost, and quality objectives
• Lead governance activities including design reviews, program reviews, risk management, and change control processes
• Partner with foundries, IP vendors, contractors, and procurement teams to resolve execution challenges and support design delivery
• Own roadmap communication, executive reporting, and collaborator alignment for HBM build programs

Minimum Qualifications

• Bachelor’s degree in Electrical Engineering or a related field, or equivalent experience
• 10+ years of relevant semiconductor industry experience
• Strong understanding of custom and digital design flows and the full SoC or DRAM development lifecycle
• Experience leading large, cross-functional technical programs through influence, collaboration, and execution rigor
• Experience working with foundries, IP vendors, and external ecosystem partners

Preferred Qualifications

• Knowledge of DRAM architecture and operation, preferably within the HBM product family
• Familiarity with industry standards and compliance requirements such as JEDEC
• Experience managing program budgets, IP investments, mask planning, and cost forecasting
• Experience with formal program or project management methodologies and tools
• Experience working with Agentic AI tools to assist with design and verification

Job Profile(s)

Systems Design Engineer Manager 2

Relocation Level: TBD

Before Getting Started

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• Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
• If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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