Sr. Equipment Engineer Etch (Multiple Positions) #9319

TSMC - Taiwan Semiconductor Manufacturing Company Limited

Arizona

On-site

USD 85,000 - 120,000

Full time

14 days+

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Benefits offered by this job

Comprehensive medical, dental, and vision plans
401(k) retirement savings plan
Paid time off and holidays

Job summary

A leading semiconductor manufacturer in Arizona seeks a Sr. Equipment Engineer – Etch to enhance equipment performance for advanced technology. The role requires a Master's or Bachelor's in Engineering with relevant experience in semiconductor manufacturing. Responsibilities include solving equipment issues, improving tool availability, and coordinating with cross-functional teams. The company offers a competitive benefits program including health options, retirement plans, and paid time off, emphasizing a supportive work environment.

Qualifications

  • Master’s degree in Electronics or related field with 1 year experience.
  • Bachelor’s degree with 3 years experience is also acceptable.
  • Willingness to work on-site in Phoenix, AZ.

Responsibilities

  • Solve critical equipment issues to improve tool uptime.
  • Drive defect reduction and capability enhancement.
  • Communicate with engineers and vendors.

Skills

Semiconductor manufacturing principles
5nm technology experience
ALD
CVD
RTP
Dry etching
Wet cleaning processing
Experience with TEL tool models
AMAT material tool installation

Education

Master’s degree in relevant field
Bachelor’s degree in relevant field

Job description

Job Title

Sr. Equipment Engineer – Etch #9319

Statement about position/company

A job at TSMC Arizona offers an opportunity to work at the most advanced semiconductor fab in the United States. TSMC Arizona’s first fab will operate its leading-edge semiconductor process technology (N4 process), starting production in the first half of 2025. The second fab will utilize its leading edge N3 and N2 process technology and be operational in 2028. The recently announced third fab will manufacture chips using 2nm or even more advanced process technology, with production starting by the end of the decade. America’s leading technology companies are ready to rely on TSMC Arizona for the next generations of chips that will power the digital future.

As a Sr. Equipment Engineer – Etch, you will demonstrate a strong sense of reliability and enthusiasm and will possess an attitude that embodies our core values – Integrity, Commitment, Innovation, and Customer Trust. Multiple positions available.

Sr. Equipment Engineer – Etch - Brief Description

Improve tool performance and availability for diffusion, thin film, lithography or etching equipment in a clean room environment. Install and qualify new tool sets according to planned schedules, to add capacity in a timely manner.

Responsibilities
  • Solve critical equipment issues, improving tool uptime availability and utilization efficiency. Identify and pursue opportunities for hardware capability enhancement, driving defect reduction. Drive root causes and corrective action analysis on process escalations. Install and qualify new tool sets for the 5‑nanometer or beyond equipment according to planned schedules and meet the process released standard. Communicate with cross‑function engineers or vendors, and serve as a module liaison with facilities, vendor, and manufacturing shift personnel.
Minimum Qualifications/Requirements
Education and Work Experience
  • Must have a Master’s degree in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 1 year of experience in an engineering role.
  • Alternatively, company will accept a Bachelor’s degree in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field, plus 3 years of experience in an engineering role.
Technical Skills
  • Must have one (1) year experience with semiconductor manufacturing principles, practices and techniques as they relate to equipment engineering and maintenance.
  • Must have one (1) year experience with 5nm technology or beyond in logic chip semiconductor industry.
  • Must have one (1) year experience in at least 1 of the following: ALD; CVD; RTP; dry etching; or wet cleaning processing.
  • Must have one (1) year of experience in Tokyo Electron Ltd (TEL) F1000/FrepCC/Leaga and Apply material (AMAT) Sym3/SRP tool models.
  • Must have completed a full facility installation process of AMAT material tool.
Physical Requirements
  • Candidates must be willing and able to work on‑site at our Phoenix Arizona facility.
Standard Work Hours

40 hrs/week, Mon‑Fri, 8:30 a.m. - 5:30 p.m.

As a valued member of the TSMC family, we place a significant focus on your health and well‑being. When you are at your best—physically, mentally, and financially—our company is at its best. We offer a comprehensive and competitive benefits program that provides the resources you need to help you manage your health and achieve your goals across many areas of your life. This includes a variety of medical, dental, and vision plan offerings you can choose from that best fit you and your family’s needs. Additionally, TSMC provides income‑protection programs to financially assist you should you experience an injury or illness, and a 401(k)-retirement savings plan to help you secure your financial future. TSMC also offers competitive paid time‑off programs and paid holidays allowing you to recharge and spend time with your family and loved ones.

Work Location

5088 W. Innovation Circle, Phoenix, AZ 85083

TSMC is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected characteristic. We encourage all qualified individuals to apply, and we welcome applications from individuals with diverse backgrounds and experiences. Candidates must be able to perform the essential functions of the job with or without a reasonable accommodation. If you need a reasonable accommodation as part of this application process, please contact P_LOA@tsmc.com. Requisition 9319

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