Software Engineering Intern, Connectivity (Summer 2027)

HP IQ

San Francisco (CA)

On-site

USD 62,000 - 70,000

Full time

43 hours ago
Be an early applicant

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Health insurance
Dental insurance
Vision insurance
Disability insurance
Employee assistance program
Flexible spending account
Life insurance
Parental leave and paid time off

Job summary

HP IQ is seeking an intern to help build on-device software for next‑generation connected experiences. You will work with seasoned engineers to design, develop, and implement software across devices and platforms, applying C/C++ or Python to real-world wireless and sensing challenges.

The role emphasizes hands‑on coding, debugging, and collaboration within a cross‑functional team, contributing to tests, validation, and documentation of connectivity features.

Qualifications

  • Proficient in on-device firmware and system software development.
  • Experience implementing wireless connectivity (Wi‑Fi, Bluetooth) in embedded devices.
  • Familiarity with edge ML/AI inference on constrained hardware.
  • Ability to debug across firmware, OS, and application layers.
  • Strong collaboration with cross-functional teams including hardware.
  • Participation in code reviews and technical design discussions.

Responsibilities

  • Develop on-device firmware and system software in C, C++, or Python for connected devices.
  • Build and enhance software supporting wireless connectivity across devices.
  • Explore ML/AI techniques to solve complex hardware/software challenges.
  • Debug and resolve issues across system software, wireless stack, and apps.
  • Collaborate with hardware and software engineers to translate requirements into solutions.
  • Participate in code reviews and design discussions with the team.

Skills

Firmware development
Wireless protocols
Edge ML / AI on embedded
Debugging embedded systems
Collaboration with hardware/software

Job description

Who We Are

HP IQ is HP’s new AI innovation lab. Combining startup agility with HP’s global scale, we’re building intelligent technologies that redefine how the world works, creates, and collaborates.

We’re assembling a diverse, world-class team—engineers, designers, researchers, and product minds—focused on creating an intelligent ecosystem across HP’s portfolio. Together, we’re developing intuitive, adaptive solutions that spark creativity, boost productivity, and make collaboration seamless.

We create breakthrough solutions that make complex tasks feel effortless, teamwork more natural, and ideas more impactful—always with a human-centric mindset.

By embedding AI advancements into every HP product and service, we’re expanding what’s possible for individuals, organisations, and the future of work.

Join us as we reinvent work, so people everywhere can do their best work.

About The Role

HP IQ's Connectivity Software team is building foundational software that enables the next generation of connected experiences across devices and platforms. Our team works at the intersection of systems software, wireless connectivity, and emerging technologies to create seamless, intelligent experiences. We are looking for an Intern to join the team and contribute to the software, protocols, and systems that bring these experiences to life.

In this role, you will work alongside experienced engineers to develop on-device software for next-generation HP IQ experiences. You’ll contribute to the design, development, and implementation of software across emerging devices and platforms. This is a hands‑on technical role where you’ll write code, solve complex system-level problems, and collaborate with engineers to explore and build new experiences.

What You Might Do
  • Develop on-device firmware and system software in C, C++, or Python for connected device experiences.
  • Build and enhance software supporting wireless connectivity across a variety of devices and platforms.
  • Explore sensing, machine learning, and AI techniques to solve complex technical challenges.
  • Debug and resolve issues across system software, wireless connectivity, and application-level code.
  • Collaborate with hardware and software engineers to understand requirements and translate them into technical solutions.
  • Participate in code reviews and technical design discussions, learning from and contributing to the broader engineering team.
  • Contribute to the testing, validation, and documentation of software and firmware features.
Essential Qualifications
  • Write efficient on-device firmware and system software in C, C++, or Python to implement wireless connectivity protocols (Wi‑Fi, Bluetooth) across multiple device types.
  • Design and implement device-to-device discovery and pairing protocols that enable seamless communication in enterprise and consumer environments.
  • Optimize machine learning inference on resource‑constrained devices, balancing model accuracy against power consumption and latency constraints.
  • Develop sensing algorithms that leverage data and AI techniques to enable new ambient and wearable interactions.
  • Debug and resolve complex issues spanning the wireless stack, operating system integration, and application‑level code.
  • Collaborate with hardware engineers, system software teams, and product managers to understand requirements and translate them into technical solutions.
  • Participate in code reviews and design discussions, learning from and contributing insights to the team's technical direction.
  • Contribute to testing, validation, and documentation of connectivity features and firmware updates.
Preferred Skills
  • Previous experience with edge machine learning or AI inference on embedded devices.
  • Familiarity with IoT or ambient computing paradigms.
  • Experience shipping consumer software products from development through production.
  • Background in IoT, wearable, or mobile device development.
  • Exposure to agentic workflows or multi-device ecosystem design.
Hourly Pay Range:

$45.00–$51.00 per hour. Actual compensation will be determined based on factors such as skills, qualifications, and experience.

2027 Internship Program Dates:

May/June–August/September 2027. Final dates will be based on student schedules.

Compensation & Benefits (Full-Time Employees)

The salary range for this role is listed above. Final salary offered is based upon multiple factors including individual job‑related qualifications, education, experience, knowledge and skills.

At HP IQ, we offer a competitive and comprehensive benefits package, including:

  • Health insurance
  • Dental insurance
  • Vision insurance
  • Long term/short term disability insurance
  • Employee assistance program
  • Flexible spending account
  • Life insurance
  • Generous time off policies, including;
    • 4-12 weeks fully paid parental leave based on tenure
    • 11 paid holidays
    • Additional flexible paid vacation and sick leave (US benefits overview)
Why HP IQ?

HP IQ is HP’s new AI innovation lab, building the intelligence to empower humanity—reimagining how we work, create, and connect to shape the future of work.

  • Innovative WorkHelp shape the future of intelligent computing and workplace transformation.
  • Autonomy and Agility Work with the speed and focus of a startup, backed by HP’s scale.
  • Meaningful Impact Build AI-powered solutions that help people and organisations thrive.
  • Flexible Work Environment Freedom and flexibility to do your best work.
  • Forward-Thinking CultureWe learn fast, stay future-focused, and imagine what comes next—together.
Equal Opportunity Employer (EEO) Statement

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

If you’d like more information about HP’s EEO Policy or your EEO rights as an applicant under the law, please click here: Equal Employment Opportunity is the Law Equal Employment Opportunity is the Law – Supplement

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Software Engineering Intern, Device Experiences (Summer 2027)
Software Engineering Intern, Device Experiences (Summer 2027)

AI Chopping Block • San Francisco (CA), Northern (KY)

Hybrid
USD 62,000 - 70,000
Health insurance
Dental insurance
Vision insurance
+5
Software Engineering Intern, Software Systems (Summer 2027)
Software Engineering Intern, Software Systems (Summer 2027)

AI Chopping Block • San Francisco (CA), Northern (KY)

Hybrid
USD 94,000 - 106,000
Health insurance
Dental insurance
Vision insurance
+7
Software Engineering Intern, Device Experiences (Summer 2027)
Software Engineering Intern, Device Experiences (Summer 2027)

HP IQ • San Francisco (CA)

On-site
USD 62,000 - 70,000
Health insurance
Vision insurance
Disability insurance
+4
Software Engineer Intern, Cloud Services (Summer 2027)
Software Engineer Intern, Cloud Services (Summer 2027)

AI Chopping Block • San Francisco (CA), Northern (KY)

Hybrid
USD 62,000 - 70,000
Health insurance
Dental insurance
Vision insurance
+7
Software Engineering Intern, AML Platform (Summer 2027)
Software Engineering Intern, AML Platform (Summer 2027)

AI Chopping Block • San Francisco (CA), Northern (KY)

Hybrid
USD 62,000 - 70,000
Health insurance
Dental insurance
Vision insurance
+7
Software Engineering Intern, Product & Developer Productivity (Summer 2027)
Software Engineering Intern, Product & Developer Productivity (Summer 2027)

AI Chopping Block • San Francisco (CA), Northern (KY)

Hybrid
USD 62,000 - 70,000
Health insurance
Dental insurance
Vision insurance
+5
Software Engineering Intern, Product Security (Summer 2027)
Software Engineering Intern, Product Security (Summer 2027)

HP IQ • San Francisco (CA)

On-site
USD 62,000 - 70,000
Health insurance
Vision insurance
Disability insurance
+4
Software Engineering Intern, Product Security (Summer 2027)
Software Engineering Intern, Product Security (Summer 2027)

AI Chopping Block • San Francisco (CA), Northern (KY)

Hybrid
USD 62,000 - 70,000
Health insurance
Dental insurance
Vision insurance
+7
Senior Wireless Systems Software Engineer
Senior Wireless Systems Software Engineer

HP IQ • San Francisco (CA)

On-site
USD 140,000 - 225,000
Health insurance
Vision insurance
Long term/short term disability
+4
Software Engineering Intern, AML Platform (Summer 2027)
Software Engineering Intern, AML Platform (Summer 2027)

HP IQ • San Francisco (CA)

On-site
USD 62,000 - 70,000
Health insurance
Vision insurance
Disability insurance
+6