Simulation Scientist Intern, 3D Multi-Physics (Summer 2027)

TOKYO ELECTRON AMERICA, INC.

Austin (TX)

On-site

USD 28,000 - 41,000

Full time

4 days ago
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Benefits offered by this job

Educational reimbursement

Job summary

TOKYO ELECTRON AMERICA, INC. in Austin, TX invites a Summer 2027 Internship for a PhD candidate in mechanical engineering or materials science to work on semiconductor 3D integration research. You will simulate mechanical processes, design elements, and build advanced models.

This paid internship runs May 17 through Aug 20, 2027, offers Lean thinking approach, and opportunities to develop skills in finite element tools and ML, with emphasis on communication and teamwork.

Qualifications

  • PhD candidate in mechanical engineering, materials science or relevant field at start
  • Experience with finite element software (Abaqus, Ansys, COMSOL, etc.)
  • Experience with ML and programming (Python, MATLAB)
  • Excellent verbal and written communication skills
  • Fluent in English
  • Preferred: semiconductor manufacturing exposure
  • Familiarity with applied statistics and advanced mathematics

Responsibilities

  • Simulate mechanical and multi-physics processes for semiconductor 3D integration
  • Design and optimize mechanical elements using modeling results
  • Create advanced models to analyze simulation and experiment results

Skills

PhD candidate communication
English fluency
Machine learning
Python
MATLAB

Education

PhD candidate in mechanical engineering or materials science

Tools

Abaqus
Ansys
COMSOL
Python
MATLAB

Job description

TOKYO ELECTRON AMERICA, INC. in Austin, TX invites a Summer 2027 Internship for a PhD candidate in mechanical engineering or materials science to work on semiconductor 3D integration research. You will simulate mechanical processes, design elements, and build advanced models.

This paid internship runs May 17 through Aug 20, 2027, offers Lean thinking approach, and opportunities to develop skills in finite element tools and ML, with emphasis on communication and teamwork.

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