Senior SoC Physical Layout & Full-Chip Integration Engineer

Intel Corporation; Hillsboro (OR); Presencial; USD 122.000 - 232.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Hybrid work model

Stock bonuses

Health benefits

Descripción de la vacante

Intel Corporation in Hillsboro, OR is seeking an experienced engineer for the X-Chip Full-Chip Integration team to lead full-chip floorplanning, layout integration, and tapeout for advanced-node silicon development vehicles.

You will develop custom layout methodologies, drive physical verification, collaborate with PDK and EDA teams, and advance designs through tape-in and silicon validation. Strong scripting and cross-functional collaboration are essential.

Formación

• Master's degree in Electrical/Computer Engineering with 4+ years industry experience.
• OR PhD with 1+ year industry experience.
• Custom/analog/mixed-signal layout on advanced technology nodes.
• Front-end layout rules, transistor matching, parasitic concepts.
• Debugging physical verification with LVS/DRC/DFM using Calibre or ICV.
• Automation using Tcl/Python/SKILL for layout tasks.

Responsabilidades

• Lead full-chip floorplanning, integration, and tapeout for advanced-node vehicles.
• Develop and refine custom layout methodologies and flows.
• Drive physical verification closure (DRC/LVS/DFM).
• Collaborate with PDK, Technology Development, and EDA teams.
• Analyze rules for design enablement in FinFET/GAA.
• Develop automation to improve productivity and quality.
• Coordinate tape-in readiness and project execution.
• Communicate tradeoffs and make sound technical decisions.

Conocimientos

Custom/analog/mixed-signal layout

FEOL layout rules

Layout debugging (LVS/DRC)

Automation scripting (Tcl/Python/SKILL

Full-chip integration

Cross-team collaboration

Educación

Master's degree in Electrical/Computer Engineering

PhD in EE or related field

Herramientas

Cadence Virtuoso

Calibre

Descripción del empleo

Job Details

Job Description: About the Role Join the Design Technology Platform (DTP) organization within Intel Foundry and help drive the development of the methodologies, physical layouts, and silicon platforms that enable next-generation semiconductor technologies. As a member of the X-Chip Full-Chip Integration team, you will play a key role in developing custom layout methodologies, leading full-chip physical integration, and driving physical verification and tapeout execution for advanced testchip and silicon lead vehicles on cutting-edge process technologies. This role is ideal for engineers who have a passion for custom layout design, advanced-node physical design methodologies, and solving complex physical integration challenges. You will work at the intersection of technology development, physical design, verification, and manufacturing, collaborating with experts across Intel Foundry to enable future process technologies and silicon solutions.

What You'll Do

Responsibilities include, but are not limited to:

• Lead full-chip floorplanning, physical integration, and tapeout activities for advanced-node silicon development vehicles.
• Develop and enhance custom layout methodologies and physical design flows.
• Drive physical verification closure, including DRC, LVS, DFM, density, and antenna rule compliance.
• Collaborate with Technology Development, PDK, and EDA teams to implement scalable and manufacturable design solutions.
• Analyze advanced-node design rules and contribute to design enablement for emerging process technologies, including FinFET and Gate-All-Around (GAA) architectures.
• Develop automation solutions using Tcl, Python, SKILL, or similar scripting languages to improve design productivity and quality.
• Coordinate cross-functional activities to ensure tape-in readiness, database integrity, and successful project execution.
• Successful Candidates Will Demonstrate Strong ownership and accountability for delivering high-quality technical results.
• Ability to make sound technical decisions with limited information and effectively communicate technical tradeoffs.
• Excellent project planning, prioritization, and execution skills.
• Strong collaboration and influence across multiple engineering disciplines and organizations.
• Effective verbal and written communication skills with both technical and non-technical stakeholders.
• Curiosity and enthusiasm for learning emerging semiconductor technologies and methodologies.
• Ability to navigate ambiguity and solve complex technical challenges in fast-paced development environments.
• Continuous improvement mindset focused on automation, scalability, quality, and engineering efficiency.

Why Join Intel Foundry?

At Intel Foundry, you'll have the opportunity to influence the future of semiconductor technology by helping develop the methodologies and silicon platforms that enable next-generation manufacturing processes. In this role, you will: Work on some of the industry's most advanced semiconductor technologies and process nodes. Collaborate with world-class experts across design, process technology, manufacturing, yield engineering, and EDA development. Drive highly visible projects that directly impact technology readiness and future product development. Gain exposure across the full silicon lifecycle, from concept and methodology development through tape-in and silicon validation. Expand your technical leadership while solving challenging engineering problems at global scale. Benefit from Intel's commitment to innovation, career development, and comprehensive employee benefits. See Intel Benefits for more details.

Qualifications

Minimum Qualifications and Experience

• Masters' degree in Electrical Engineering, Computer Engineering, or a related field with 4+ years of industry experience.
• OR a PhD's degree in the same filed with 1+ years of industry experience.
• Your experience outlined above must be in the following:
• Custom/analog/mixed-signal layout design experience in advanced technology nodes.
• Front-end (FEOL) layout design rules, transistor-level matching, parasitic layout concepts, and custom silicon structures..
• Debugging skills in physical verification (LVS, DRC, and DFM) using industry-standard verification engines (such as Calibre or ICV), with a proven ability to solve complex, systemic layout errors.
• Tcl, Python, or SKILL to automate layout creation, checking, and full-chip database manipulation.

Preferred Qualifications and Experience

• Experience with top-level floorplanning, RDL/bump planning, or backside power delivery (PowerVia) implementation.
• Proven track record of collaborating with PDK and Technology Development teams on design rule definitions, test structure vehicles, or DRC suppression strategies.
• Experience managing physical tapeout schedules, IP tracking matrices, and formal physical design Quality Assurance (QA) flows.
• Familiarity with custom layout environments (such as Cadence Virtuoso) and translating custom databases into full-chip NDM flows.
• Previous related work experience in a semiconductor foundry preferred.

Location

Location: Primary - Hillsboro OR Additional - Chandler AZ, Austin TX.

Job Type

Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix, US, Texas, Austin Posting Statement:

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site.

* Job posting details (such as work model, location or time type) are subject to change.

* ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment.

Intel’s official careers website. Find your next job and take on projects that shape tomorrow’s technology.

Benefits Internships Life at Intel Locations Recruitment Process