Senior SiPh Product Development Engineer

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 164,000 - 232,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Paid vacation

Hybrid work model

Job summary

Intel Corporation, based in the United States, seeks a seasoned leader to develop and industrialize next-generation silicon photonics and high-speed optical products from concept to high-volume manufacturing.

You will guide cross-functional teams across design, fabrication, assembly, test, quality, and operations, driving POR execution and manufacturing readiness to deliver top-performance, high-quality products on schedule.

Qualifications

• BS in Physics, Electrical Engineering, Optical Engineering or related field with 6+ years of experience, or MS with 4+ years.
• 3+ years in high-speed optical component or product development or silicon photonics.
• Experience with semiconductor fabrication process development or wafer-level assembly/packaging.

Responsibilities

• Lead matrixed teams across design, fab, assembly, test, quality and operations.
• Drive end-to-end development of Photonic ICs and Electronic ICs through production ramp.
• Balance technical tradeoffs with cost, schedule and risk to meet objectives.
• Identify and mitigate risks with contingency planning and cross-functional alignment.
• Ensure manufacturing readiness, including wafer-start planning and site certification.

Skills

Collaborative leadership

Analytical decision-making

Proactive communication

Education

BS in Physics, Electrical or Optical Engineering

Master's degree (preferred)

Job description

## Job Description:Intel's Integrated Photonics Solutions (IPS) organization is driving the future of high-performance computing and networking through the development of advanced optical interconnect technologies built on Intel's silicon photonics platform.**Position Overview**Lead the development and industrialization of next-generation silicon photonics and high-speed optical products from concept through high-volume manufacturing. Drive technical execution, manufacturing readiness, and cross-functional decision-making to deliver products that meet performance, quality, cost, and schedule objectives.**Key Responsibilities**• Lead matrixed teams across design, fab, assembly, test, quality, and operations to define and execute the product Plan of Record (POR). • Drive end-to-end development of Photonic ICs (PICs), Electronic ICs (EICs), and manufacturing process technologies from concept through production ramp. • Balance technical tradeoffs, business priorities, cost, schedule, and risk to enable informed decision-making and successful product execution. • Identify and mitigate technical and execution risks through contingency planning and cross-functional alignment. • Drive manufacturing readiness, including wafer-start planning, qualification strategy, capacity analysis, customer sampling, and assembly/test site certification. • Serve as the primary interface to stakeholders and leadership, providing clear communication of product status, risks, and recommendations. • Build strong partnerships across organizations to accelerate execution and deliver business results. • Interface with fab, optical design, hardware, firmware, IC design, test, operations, and quality teams to ensure successful product development and manufacturing ramp.**What We're Looking For**You should demonstrate the following professional traits to be successful: • Strong collaborative leadership to effectively guide cross-functional, matrixed engineering and operational teams. • Analytical decision-making to balance complex technical tradeoffs with business priorities, costs, and schedule constraints. • Proactive communication and stakeholder management to clearly convey product status, risks, and recommendations to leadership.#### **Qualifications:**## **Minimum Qualifications**• BS in Physics, Electrical Engineering, Optical Engineering, or a related discipline with 6+ years of relevant industry experience, or a Master's degree with 4+ years of relevant industry experience. • 3+ years of experience in one or more of the following: • High-speed optical component or product development• Silicon photonics development • Semiconductor fabrication process development • Wafer-level assembly or packaging development • Test development and validation**Preferred Qualifications**• Experience in silicon photonics, optical transceivers, or semiconductor product development, plus 2 or more of the following skills: • 3+ years of semiconductor fab process experience • 3+ years of assembly, packaging, or manufacturing process experience • Proven track record of leading cross-functional engineering teams and successfully transitioning products from development to high-volume manufacturingJoin us in shaping the future of technology by bringing your expertise and passion to Intel's Silicon Photonic Design team.## Job Type:Experienced Hire## Shift:Shift 1 (United States of America)## Primary Location:US, Arizona, Phoenix## Additional Locations:US, California, Santa Clara, US, New Mexico, Albuquerque## Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.## ## Position of TrustN/A## BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.Annual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.**Work Model for this Role**This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. \\* Job posting details (such as work model, location or time type) are subject to change.