Senior SI/PI Engineer for High-Speed Packages & PDN

MaxLinear, Inc.; Irvine (CA); On-site; USD 135,000 - 183,000; Full time

Job summary

MaxLinear is seeking a Senior Staff Signal & Power Integrity Engineer to develop state-of-the-art packages and PCBs for our next generation products. The role emphasizes SI/PI simulations, optimization, and PDN design for high-speed interfaces and SoC packages.

You will collaborate with systems, IC design, layout, and test teams, applying RF/mm-wave, 5G, and optical concepts to enable reliable data center connectivity and AI workloads.

Qualifications

• Deep understanding of EM fundamentals, transmission lines, and microwave theory.
• Experience designing and simulating SI/PI for high-speed system components (packages, PCB, connectors).
• Experience with high-speed channel simulations for SerDes and transient SI/PI.
• Understanding of S-parameters, Smith Chart, and frequency domain analysis.
• Proficiency with 2.5D/3D solvers like HFSS/SIwave/Cadence Sigrity; ADS/SPECTRE for time/frequency analysis.

Responsibilities

• Develop state-of-the-art packages and PCBs for MaxLinear’s next generation products.
• Perform SI/PI simulations and optimization to ensure critical signals meet specifications.
• Design and simulate high-speed interfaces and PDN for advanced SoC packages and PCBs.
• Collaborate with cross-functional teams including systems, IC design, package/PCB layout, and test/characterization.

Skills

Electromagnetic fundamentals

Transmission lines

Microwave theory

SI/PI simulations

Education

BS in Electrical Engineering or related + 7 years

MS in Electrical Engineering + 5 years

PhD + 2 years

Tools

ANSYS HFSS

SIwave

Cadence Sigrity

Job description

MaxLinear is seeking a Senior Staff Signal & Power Integrity Engineer to develop state-of-the-art packages and PCBs for our next generation products. The role emphasizes SI/PI simulations, optimization, and PDN design for high-speed interfaces and SoC packages.

You will collaborate with systems, IC design, layout, and test teams, applying RF/mm-wave, 5G, and optical concepts to enable reliable data center connectivity and AI workloads.