Senior RF & High-Speed Interconnect Architect

FormFactor, Inc.; Beaverton (OR); On-site; USD 139,000 - 182,000; Full time

Job summary

FormFactor, Inc. in Beaverton, Oregon, is seeking a senior RF/HDI engineer to lead architecture, modeling, and validation for RF interconnects and high‑speed digital systems. You will drive next‑gen calibration methods, test philosophy, and measurement strategies to improve product performance.

You will collaborate with customers and cross‑functional teams to translate requirements into robust architectures and ensure design for manufacturability from concept through production.

Qualifications

• Bachelor’s degree in Electrical Engineering or related field with 12+ years of experience.
• Extensive experience in RF, microwave, millimeter‑wave, high‑speed interconnect or related test & measurement technologies.
• Proven ability to lead highly complex technical programs and influence technology direction.
• Demonstrated patents, publications, or industry recognition in RF/interconnect.

Responsibilities

• Define and influence long‑term technology strategies and roadmaps for RF/high‑speed interconnects.
• Lead architecture, design, modeling, development, and optimization of RF interconnect systems.
• Develop RF measurement, calibration, de-embedding methodologies and validation.
• Engage with customers and partners to translate needs into technology requirements and plans.

Skills

HFSS

High Speed PCB Design

RF Calibration

RF Measurements

RF Simulations

Education

12+ years experience with a Bachelor's degree

Tools

HFSS

ADS

Sigrity

AWR

Job description

FormFactor, Inc. in Beaverton, Oregon, is seeking a senior RF/HDI engineer to lead architecture, modeling, and validation for RF interconnects and high‑speed digital systems. You will drive next‑gen calibration methods, test philosophy, and measurement strategies to improve product performance.

You will collaborate with customers and cross‑functional teams to translate requirements into robust architectures and ensure design for manufacturability from concept through production.