Senior R&D Application Engineer – Electronics Materials

Element Solutions Inc; Indiana (PA); On-site; USD 80,000 - 100,000; Full time

Benefits offered by this job

Competitive salary

Performance-related bonus scheme

Comprehensive insurance benefits

Job summary

Element Solutions Inc is searching for a technically strong Application Engineer in Indiana, PA. The role requires expertise in electronic materials and customer focus. Responsibilities include supporting new product introductions, performing failure analysis, and collaborating with cross-functional teams. Candidates should have a B.E. / M.Sc. in relevant fields and 5+ years of experience in semiconductor assembly or materials-based applications. A competitive salary, bonuses, and comprehensive insurance benefits are offered.

Qualifications

• 5+ years of experience in semiconductor assembly or materials-based application process development.
• Experience with die attach or advanced packaging preferred.

Responsibilities

• Support development, validation, and optimization of next-generation electronic materials.
• Troubleshoot issues faced by customers during new product introduction stage.
• Conduct failure mode analysis, identify defects and recommend improvements.
• Perform product evaluations, trials, and performance testing.
• Conduct field trials or on-site customer testing.
• Work closely with R&D, sales, and product management on technical projects.

Skills

Analytical thinking

Problem-solving

Documentation

Communication

Project management

Excel

Minitab

CAD tools like SolidWorks

Education

B.E. / MSc / M.E. / MTech in Electronics, Materials Science, Nanotechnology, Physics

Tools

Screen printers

Pick-and-place machines

Reflow ovens

Sinter presses

Environmental test chambers

Die shear machines

Electrical probing systems

CAD tools like SolidWorks

Job description

Element Solutions Inc is searching for a technically strong Application Engineer in Indiana, PA. The role requires expertise in electronic materials and customer focus. Responsibilities include supporting new product introductions, performing failure analysis, and collaborating with cross-functional teams. Candidates should have a B.E. / M.Sc. in relevant fields and 5+ years of experience in semiconductor assembly or materials-based applications. A competitive salary, bonuses, and comprehensive insurance benefits are offered.