Senior Member of Technical Staff - Etch RF Engineering

Mattson Technology; Fremont (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

Mattson Technology, Inc. is seeking a Senior Member of Technical Staff to lead RF systems architecture for next-generation plasma processing tools.

You will collaborate across mechanical, electrical, and process teams to improve tool capability and reliability, guiding hardware qualification and data-driven problem solving. You will direct projects from concept to high-volume manufacturing and support global deployments, traveling up to 10% for customer sites and field escalations.

Qualifications

• Ph.D. or M.S. in Electrical Engineering or related field with 5+ years of experience.
• Strong knowledge of plasma etch/strip processing and RF hardware.
• Experience with high-power RF systems and diagnostics.
• Ability to lead cross-functional efforts and manage critical projects.
• Excellent communication and initiative in demanding environments.

Responsibilities

• Architect and optimize RF components and delivery networks for plasma processing tools.
• Lead cross-functional initiatives across mechanical, electrical, and systems teams.
• Qualify new RF hardware for integration into plasma platforms.
• Apply data analytics to diagnose anomalies and define hardware specs.
• Drive projects from concept through high-volume manufacturing.
• Support international deployments with expert escalation management.

Skills

Cross-functional leadership

Data analytics

Problem solving

Communication skills

Project management

Education

Ph.D. in Electrical Engineering

M.S. in Electrical Engineering

B.S. in Electrical Engineering or related

Tools

RF measurement equipment

Job description

Company: Mattson Technology, Inc., a 38-year Silicon Valley company, designs, manufactures, markets, and globally supports plasma and rapid thermal processing equipment to fabricate integrated circuits for the global semiconductor industry.

Mattson Technology, Inc. offers processing equipment that utilizes innovative technologies to deliver advanced processing capabilities and high productivity for the fabrication of current and next-generation integrated circuits. Our equipment and technologies are used by leading memory and logic, analog /power device manufacturers worldwide. Innovations from Mattson Technology in Atomic Surface Engineering address the most critical logic and memory manufacturing challenges.

In May 2016, Mattson Technology was acquired by Beijing’s E-Town Capital. Our new investor’s vision is that Mattson Technology, with its Silicon Valley DNA, will continue to operate as a global, market-driven technology provider serving worldwide semiconductor manufacturing customers. In July, 2025, the company successfully listed in Shanghai’s STAR Exchange. As the external trade compliance environment evolves, Mattson Technology now operates independently from the parent company in product, business, and operations, serving customers outside of China.

As a Senior Member of Technical Staff, you will serve as a principal technical architect for our Radio Frequency (RF) systems. This high-impact role requires an expert blend of plasma physics, advanced hardware engineering, and cross-functional leadership to drive continuous improvements in tool capability, system performance, and operational productivity.

Key Responsibilities

• RF Systems Engineering: Architect, evaluate, and optimize advanced RF components and delivery networks for next-generation plasma processing equipment.
• Cross-Functional Leadership: Spearhead collaborative initiatives across the business unit, partnering with mechanical, electrical, systems, process, and supply chain teams, as well as external vendors—to elevate tool capability and reliability.
• Hardware Qualification: Lead the comprehensive characterization, benchmarking, and formal qualification of newly designed RF hardware for seamless integration into plasma processing platforms.
• Data-Driven Problem Solving: Utilize advanced data analytics to rapidly diagnose and resolve complex customer anomalies, establishing rigorous operational limits and hardware specifications.
• Lifecycle Management: Direct critical projects from initial Concept & Feasibility (C&F) phases through formal product release and high-volume manufacturing (HVM).
• Strategic Customer Alignment: Drive the integration of innovative technology solutions at global customer sites, providing expert technical support and escalation management during international deployments (up to 10% travel).

Required Qualifications

• Education & Experience: Ph.D. or M.S. in Electrical Engineering, Physics, Materials Science, or a related discipline with 5+ years of relevant industry experience; or a B.S. degree with 10+ years of progressive technical experience.
• Technical Domain Expertise: Comprehensive knowledge of state-of-the-art plasma etch and strip processing, advanced hardware architecture, and systematic troubleshooting of high-power RF systems.
• Process-Equipment Interaction: A deep technical understanding of how equipment hardware configurations directly impact semiconductor process performance and yield metrics.
• Crisis & Deadline Management: Proven ability to navigate highly dynamic environments and resolve critical internal or customer-facing issues under strict timeline constraints.
• Communication & Initiative: Exceptional verbal and written business communication skills, paired with a self-motivated approach to technical ownership and project execution.