Senior Manager, HBM Customer Integration Technical Leader

1000 Micron Technology, Inc.

Boise (ID)

On-site

USD 140,000 - 190,000

Full time

9 days ago
Application generator

Get a reply from this employer — a resume and cover letter tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Medical, dental, vision plans
Paid time off
Retirement benefits

Job summary

Micron Technology, Inc. in Boise, Idaho is seeking a Technical Leader to serve as the primary technical interface between customers and internal engineering teams for advanced HBM solutions. The role focuses on translating customer requirements into internal design and manufacturing plans with emphasis on AI-enabled processes.

You will mentor teams on HBM architecture, signal integrity, thermal solutions, and packaging while driving system validation, debugging, and customer enablement workflows.

Qualifications

  • Bachelor’s or Master’s degree in Electrical Engineering or related field.
  • 10+ years in semiconductor product engineering, system integration, or customer-facing technical roles.
  • Hands-on experience with HBM architecture, packaging, and manufacturing processes.
  • Ability to interpret customer system-level requirements and map them to internal capabilities.
  • Strong communication and collaboration across technical and non-technical teams.

Responsibilities

  • Understand customer system architecture and integration challenges.
  • Translate customer needs into actionable requirements for internal teams.
  • Mentor on HBM architecture, signal integrity, thermal solutions, and packaging.
  • Develop and deploy AI systems to automate processes and address challenges.
  • Collaborate across front-end/back-end process engineering, product development, and manufacturing.
  • Lead design reviews, failure analyses, and yield improvement initiatives.

Skills

Customer engagement
System integration
Technical leadership
AI systems deployment
Communication
Root cause analysis

Education

Electrical/Electronic Eng. degree

Tools

HBM architecture
Packaging tech
Debugging tools

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of the Customer Engineering Technical Leadership (CETL) function within HIG PSE, the Technical Leader will serve as a key technical interface between external customers and internal engineering teams. In conjunction with CIL (Customer Integration Lead), this role requires deep technical engagement to understand customer application requirements and align them with internal HBM design, product engineering, and manufacturing processes (Front-End and Back-End). The position emphasizes technical problem-solving, multi-functional teamwork, and driving integration success for advanced HBM products. Develops and deploys AI systems that help automate processes and tackle technical challenges.

Responsibilities
  • Develop a strong understanding of customer system architecture, application requirements, and integration challenges.
  • Translate customer technical needs into actionable requirements for internal design, product engineering, and manufacturing teams.
  • Provide technical mentorship on HBM architecture, signal integrity, thermal solutions, and packaging strategies.
  • Develops and deploys AI (artificial intelligence) systems that help automate processes and tackle technical challenges.
  • Work closely with internal teams across front-end/back-end process engineering, product development, and manufacturing to ensure seamless integration.
  • Support design reviews, failure analysis, and yield improvement initiatives tied to customer requirements.
Minimum Qualifications
  • In conjunction with CIL, participate in technical discussions with customers, including design reviews and debug sessions.
  • Communicate technical solutions clearly and optimally to both customer engineering teams and internal collaborators.
  • Lead root-cause analysis for integration issues and propose design or process optimizations.
  • Ensure timely resolution of technical partner concerns and maintain alignment across engineering and manufacturing teams.
  • Lead the strategy, development, deployment, and adoption of engineering capabilities powered by intelligent technology that accelerate product development across system validation, debug, characterization, and customer enablement workflows.
Preferred Qualifications
  • Bachelor’s or Master’s degree or equivalent experience in Electrical Engineering, Computer Engineering, or related technical field.
  • 10+ years in semiconductor product engineering, system integration, or customer-facing technical roles.
  • Hands-on experience with HBM architecture, packaging, and manufacturing processes highly desired.
  • Ability to interpret customer system-level requirements and map them to internal design and process capabilities.
  • Excellent communication and collaboration skills across technical and non-technical teams.

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here.

To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Senior Manager, HBM Customer Integration Technical Leader
Senior Manager, HBM Customer Integration Technical Leader

Micron Technology, Inc • Boise (ID)

On-site
USD 180,000 - 240,000
Medical, Dental, Vision plans
Paid time off
Paid holidays
Engineering Execution Manager, HIG High Bandwidth Memory (HBM)
Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

Micron Technology • Boise (ID)

On-site
USD 130,000 - 190,000
Principal Customer Integration Engineer, Product & Process Engineering (HBM)
Principal Customer Integration Engineer, Product & Process Engineering (HBM)

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 70,000 - 90,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
+1
Principal Customer Integration Engineer, Product & Process Engineering (HBM) Boise, Idaho, Unit[...]
Principal Customer Integration Engineer, Product & Process Engineering (HBM) Boise, Idaho, Unit[...]

Micron Memory Malaysia Sdn Bhd • Boise (ID)

On-site
USD 120,000 - 170,000
Medical, dental and vision plans
Paid time-off
Paid holidays
+1
Engineering Execution Manager, HIG High Bandwidth Memory (HBM)
Engineering Execution Manager, HIG High Bandwidth Memory (HBM)

Micron Technology, Inc • Boise (ID)

On-site
USD 100,000 - 130,000
Comprehensive health benefits
Paid time-off
Paid family leave
Sr Design Engineer, HBM
Sr Design Engineer, HBM

Micron Technology • Richardson (TX)

On-site
USD 130,000 - 180,000
Sr Design Engineer, HBM
Sr Design Engineer, HBM

Micron • Richardson (TX)

On-site
USD 140,000 - 190,000
Medical, dental, vision plans
Paid time-off
Paid holidays
Staff Design Engineer, HBM
Staff Design Engineer, HBM

Micron Technology, Inc • Richardson (TX)

On-site
USD 120,000 - 150,000
Medical, dental and vision plans
Paid time-off
Paid family leave
Principal Customer Integration Engineer, Product & Process Engineering (HBM)
Principal Customer Integration Engineer, Product & Process Engineering (HBM)

Micron Technology, Inc • Boise (ID)

On-site
USD 85,000 - 115,000
Medical, dental, and vision plans
Paid time off
Paid holidays
+2
Custom HBM Architecture and Design Engineer
Custom HBM Architecture and Design Engineer

Micron Technology • Folsom (CA)

On-site
USD 165,000 - 329,000
Medical, dental and vision plans
Paid time off
Paid holidays