Senior Hardware Engineer: Lead Aerospace Systems

Lockheed Martin Corporation

Town of Owego (NY)

Sur place

USD 105 000 - 195 000

Plein temps

Il y a 2 heures
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Avantages offerts par ce poste

Medical, Dental, Vision
401(k) match
Paid time off
Relocation assistance

Résumé du poste

Lockheed Martin Corporation is seeking a skilled Hardware Engineer Level 4 for the Owego, NY area. You will act as a technical lead, architecting and validating advanced hardware systems, including analog/digital computing and radar-related hardware. Significant ownership of schematics and documentation is expected.

You will mentor engineers, drive hardware packaging and integration, and oversee prototype bring-up and testing, with up to 10% travel.

Qualifications

  • Bachelor's degree required in Computer or Electrical Engineering.
  • Experience with digital circuit and logic design and processor architecture.
  • Ability to obtain and maintain a secret clearance.
  • Willingness to travel up to 10%.

Responsabilités

  • Lead full lifecycle design and development of complex hardware systems.
  • Own electrical schematics and hardware design documentation.
  • Provide technical leadership and mentorship to junior engineers.
  • Lead hardware packaging and system integration activities.
  • Lead prototype bring-up, integration, and validation testing.
  • Apply advanced engineering principles to develop new technologies.
  • Design and test analog/digital computing hardware and radar-related systems.

Connaissances

Digital circuit design
Processor design
Mentorship/leadership
Secret clearance eligibility

Formation

Bachelor's degree in Computer or Electrical Engineering

Description du poste

Lockheed Martin Corporation is seeking a skilled Hardware Engineer Level 4 for the Owego, NY area. You will act as a technical lead, architecting and validating advanced hardware systems, including analog/digital computing and radar-related hardware. Significant ownership of schematics and documentation is expected.

You will mentor engineers, drive hardware packaging and integration, and oversee prototype bring-up and testing, with up to 10% travel.

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