Signal Processing Engineer

Foxconn Interconnect Technology (FIT); San Jose (CA); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Competitive compensation

World-class benefits

Incentive and recognition programs

Job summary

A global electronics firm is seeking a Senior DSP Application/Electrical Design Engineer located in San Jose, CA. This role focuses on optimizing signal quality and ensuring system level interoperability across data center platforms. The ideal candidate will have over 5 years in high-speed DSP/PHY system integration and experience with DSP tuning, integration, and cross-team collaboration. Competitive compensation and world-class benefits are offered for this position.

Qualifications

• Experience in high-speed DSP integration required.
• Ability to optimize signal quality and interoperability.
• Co-ordinate between hardware and firmware teams.

Responsibilities

• Integrate third party DSP/retimer ICs.
• Own DSP tuning and link adaptation optimization.
• Provide tuning feedback to teams.

Skills

DSP-Based retimer integration

Adaptation Control (FFE/DFE/CTLE)

Eye Margining and BER Correlation

Familiar with 802.3 Ethernet/OIF/InfiniBand management parameters

Familiar with Serdes architecture

Education

5+ Years in High-Speed DSP/PHY system integration

Job description

Job Title

DSP Application/ Electrical Design Engineer, Senior

Job Location

Irvine, CA/ San Jose, CA

Job Description

This role bridges the gap between hardware and firmware, optimizing signal quality and ensuring system level interoperability across datacenter platforms.

Specific Duties to be Performed

• Integrate third party DSP/retimer IC’s
• Own DSP tuning and link adaption optimization post bring up
• Co-ordinate with vendors for firmware and register map updates
• Provide tuning feedback to hardware and firmware teams

Experience preferred

• DSP- Based retimer integration.
• Adaptation Control (FFE/DFE/CTLE)
• Eye Margining and BER Correlation
• Familiar with 802.3 Ethernet/OIF/InfiniBand management parameters/spec from physical layer to MAC layer.
• Familiar with Serdes architecture

Education/Certification Preferred

• 5+ Years in High-Speed DSP/PHY system integration.

Foxconn Interconnect Technology, Inc. (“FIT”) focuses on the development, manufacturing and marketing of electronic and optoelectronic connectors, antennas, acoustic components, cables, and modules for applications in computers, communication equipment, consumer electronics, automobiles, industrial and green energy field products.

We offer our employees competitive compensation and world class benefits. In addition, we recognize the performance of the company, business unit and individual through our incentive and recognition programs. FIT is an equal opportunity employer Minorities/Females/Protected Veterans/Disabled.