Senior Director, Package Design Engineering

Renesas; Austin (TX); On-site; USD 210,000 - 260,000; Full time

Job summary

Renesas Electronics is seeking a Sr. Director, Technical Program Management to lead a global TPM organization responsible for AI/Datacenter Infrastructure Power package engineering and NPI programs.

You will partner with Package Engineering Directors and Power product group partners to ensure schedules, quality, and production readiness are achieved. The role involves governance, risk management, and leading cross-functional task forces to resolve challenges impacting quality, reliability,

Qualifications

• Doctorate, Master’s, or Bachelor’s Degree in Electrical Engineering, Materials Science, Physics, Chemistry, or related technical discipline.
• 15–20+ years of experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, TPM, or related field.
• Experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.

Responsibilities

• Lead the global TPM organization supporting AI/Datacenter Infrastructure Power NPI and package engineering programs.
• Provide program-level execution leadership, governance, and accountability with Package Engineering Directors.
• Establish end-to-end NPI program plans, milestones, risk management, and executive reporting to meet schedules.
• Create a disciplined TPM operating model covering development, qualification, production readiness, ramp, and transition to volume manufacturing.

Skills

Program management

Cross-functional leadership

Semiconductor NPI

OSAT/CM coordination

Risk management

Executive communication

Data-driven problem solving

Education

Bachelor’s degree in Electrical Engineering

Job description

• Full-time
• Employment Type: Regular (PERM)
• Remote Work Available: No

Job Description

The Sr. Director, Technical ProgramManagementwill lead a global technical program management organization responsible for driving execution of strategic AI/Datacenter Infrastructure Power package engineering and new product introduction (NPI) programs. This leader will partner closely with Package Engineering Directors,Power product group partners—especiallyDesign, Application, and Marketing teams—Product, Reliability, Quality, Operations, Supply Chain, and key OSAT/CM partners to ensure programs meet committed schedules, quality and reliability objectives, and production readiness requirements. The role willestablishstrong program governance,identifyand escalation critical risks early, and lead cross-functional technical task forces to resolve development challenges that threaten quality, reliability, yield, manufacturability, or schedule.

The organization will also provide technical program management leadership at key OSATs, ensuring consistent execution, issue escalation, and alignment between Renesas development teams and external assembly partners.

KEY RESPONSIBILITIES

Lead the global Technical Program Management (TPM) organization supporting AI/Datacenter Infrastructure Power NPI and package engineering programs.

Partner with Package Engineering Directors who lead technical package development programs, providing program-level execution leadership, governance, and accountability.

Establish and drive end-to-end NPI program plans, milestones, critical paths, resource alignment, risk management, and executive reporting to ensure committed schedules are achieved.

Create a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing.

Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks; establish mitigation plans and escalation critical issues with clear recommendations and decision points.

Lead cross-functional technical task forces for major development challenges, particularly issues affecting quality, reliability, yield, manufacturability, qualification, or NPI schedule.

Drive structured problem solving and closure of critical issues using data-driven methods, root-cause analysis, risk assessment, and clearly defined corrective/preventive actions.

Coordinate closely with Package Engineering,Power product group partners—especiallyDesign, Application, and Marketing teams—Product Engineering, Reliability, Quality, Operations, Supply Chain, and other functional leaders to remove execution barriers and maintain program momentum.

Establish program dashboards and management systems that provide transparent visibility to milestones, critical path activities, risks, issues, action owners, and recovery plans.

Lead technical program management activities with key OSAT/CM partners, including program reviews, milestone tracking, issue escalation, recovery plans, qualification readiness, and production ramp execution.

Ensure execution of Engineering Build Requests (EBRs) per committed schedule at each OSAT, regularly tracking overall EBR progress, identifying delays, and driving timely recovery actions.

Develop and lead TPM teams located at strategic OSATs, ensuring alignment with Renesas priorities, technical teams, and global NPI schedules.

Ensure OSAT/CM development activities, DOE, process optimization, qualification, process-window verification, production controls, and ramp readiness are aligned with overall NPI program objectives.

Drive timely resolution of process integration and assembly issues that could impact product quality, reliability, qualification, yield, or customer commitments.

Ensure effective transition from development and qualification into production, including readiness reviews, ramp monitoring, issue management, and sustained execution.

Establish standardized program management processes, templates, metrics, escalation mechanisms, and lessons-learned practices across the global organization.

Provide concise, fact-based executive communication on program health, critical risks, schedule recovery, resource needs, and decisions required from senior leadership.

Build strong relationships with OSAT/CM executive and technical leadership to improve responsiveness, accountability, and execution of critical AI/Datacenter Power programs.

Develop the technical and leadership capabilities of the TPM organization and establish a high-performance, execution-focused culture.

Support package technology roadmap execution by translating strategic technology priorities into executable development programs, milestones, resources, and deliverables.

Address internal and external customer-impacting issues in partnership with Marketing, Product, Quality, Operations, and Package Engineering organizations.

LEADERSHIP & ORGANIZATIONAL RESPONSIBILITIES

Lead and develop a global team of Technical Program Managers supporting strategic AI/Datacenter Infrastructure Power programs.

Set organizational priorities, staffing strategy, performance expectations, and development plans aligned with business growth.

Establish clear accountability between Technical Program Managers and Package Engineering technical leaders while avoiding duplication of technical ownership.

Create a culture of urgency, fact-based decision making, cross-functional collaboration, ownership, and rapid issue resolution.

Drive consistent execution standards across internal teams and strategic OSAT locations.

Qualifications

QUALIFICATIONS

Doctorate, Master’s, orBachelor’s Degree inElectricalEngineering, Materials Science, Physics, Chemistry, ora related technical discipline.

15–20+ years of relevant experience in semiconductor engineering,product development, applications,package development, NPI, manufacturing, technical program management, or a closely related field.

Demonstrated experience leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.

Strong understanding of semiconductor product development process, package and assembly processes.

Experience in Power Management products, particularly powerSiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages,battery management system, PMICs, wafer-level and/or flip-chip technologies.

Experience working with OSATs/CMs and managing complex development and production activities across geographically distributed organizations.

Proven track record leading cross-functional technical task forces and resolving complex issues involving quality, reliability, yield, manufacturability, and schedule.

Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.

Exceptional program management skills, including critical-path management, risk management, executive escalation, schedule recovery, and cross-functional resource alignment.

Strong interpersonal, communication, negotiation, and executive presentation skills.

Ability to influence senior technical and business leaders without direct authority and drive accountability across organizational boundaries.

Experience building and leading global teams, including teams in product groups, embedded at external manufacturing or OSAT locations.

Strong analytical skills and ability to translate complex technical issues into clear business impact, decisions, and actions.

PREFERRED QUALIFICATIONS

Experience supporting high-growth customer programs.

Experience with Smart Power Stage, Vertical Power Stage, power module, discreteFET, SiC/GaN, DBC/AMB, multi-chip, wafer-level, or advanced interconnect technologies.

Experience with formal technical program management methodologies and portfolio-level governance.

Experience driving customer-critical NPI programs in a fast-paced, high-growth environment.

SUCCESS MEASURES

On-time achievement of NPI milestones and customer commitments.

Reduction in schedule delays caused by unresolved technical, quality, reliability, or manufacturing issues.

Timely closure of critical cross-functional task‑force actions.

Improved qualification, yield, reliability, and production‑readiness performance.

Effective execution and alignment of strategic OSAT/CM partners.

Development of a high-performing global TPM organization and standardized program‑management operating model.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement .

Renesas Electronics deals with dual‑use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

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