Senior Digital Test Engineer — Silicon Validation & AI Testing

Socket.dev; San Diego (CA); On-site; USD 111,000 - 167,000; Full time

Benefits offered by this job

Annual bonus

RSU grants

Job summary

Qualcomm Technologies, Inc. is seeking Digital Test Engineers to create test solutions for silicon validation and manufacturing enablement of SOC products.

You will work on IP areas like microprocessors, HSIO, logic, and memory while advancing DFT/DFM and AI-driven test development. The role offers opportunities to collaborate across packaging, RF/photonic devices, and 2.5D/3D IC testing, with emphasis on analytical reviews and test time optimization.

Qualifications

• Bachelor's degree in Engineering, Information Systems, Computer Science, Optics/Photonics or related field.
• Knowledge of Python, Java, and Linux.
• Experience working with common test equipment (oscilloscopes, spectrum analyzers, logic analyzers, network analyzers).
• Knowledge of signal integrity and transmission line theory.
• 3+ years Hardware Engineering experience or related work experience.

Responsibilities

• Create test solutions in support of New Product Introduction (Silicon Validation and Characterization) and Manufacturing Enablement of Qualcomm SOC products.
• Collaborate with packaging teams on 2.5D/3D IC testing, thermal test analysis, PICs, and RF/photonic devices.
• Contribute to Debug, DFT/DFM, test time improvements, and analytics with Design and DFT teams.

Skills

Python

Java

Linux

Test equipment knowledge

Signal integrity

Hardware engineering

Debugging

Advantest 93K / Teradyne UFlex/IFlex

Education

Bachelor's Degree in Electrical Engineering or related field

Master's or PhD preferred

Tools

Advantest 93K

Teradyne UFlex/IFlex

Job description

Qualcomm Technologies, Inc. is seeking Digital Test Engineers to create test solutions for silicon validation and manufacturing enablement of SOC products.

You will work on IP areas like microprocessors, HSIO, logic, and memory while advancing DFT/DFM and AI-driven test development. The role offers opportunities to collaborate across packaging, RF/photonic devices, and 2.5D/3D IC testing, with emphasis on analytical reviews and test time optimization.