Senior Device Characterization Engineer - Semiconductor

Renesas; Morrisville (NC); On-site; USD 120,000 - 170,000; Full time

Job summary

Renesas in Morrisville, NC, is seeking a Senior Staff Device Characterization Engineer to lead cutting-edge power device development. You will be responsible for wafer- and package-level measurements, I-V curves, and reliability tests, working on-site with the TD team.

You will operate HP and Agilent equipment, develop software for device modeling, and collaborate with teammates to debug test chips while upgrading hardware and software as testing needs evolve.

Qualifications

• Bachelor's or Master's degree in Electrical Engineering.
• 10+ years of hands-on semiconductor device characterization experience.
• Familiarity with HP RMB or SPECS; scripting in Python/MatLab or JMP is a plus.
• Unix systems proficiency and lab equipment skills will be used daily.
• Experience with probers, parameter analyzers and S-parameter systems.
• Cadence Virtuoso knowledge for device layout is preferred.

Responsibilities

• Oversee and maintain test equipment used in device characterization.
• Conduct measurements on wafer level and package parts, including I-V curves and reliability tests.
• Perform transient measurements (Gate charge, reverse recovery) and S-parameter measurements.
• Develop new software as needed by device development and modeling teams.
• Collaborate to debug test chip programs and upgrade hardware/software as requirements evolve.
• Utilize HP instruments (RMB, IC-CAP, probers) and Agilent B1500 for test automation.

Skills

Device characterization

S-parameter analysis

Test automation

Education

Electrical Engineering degree (Bachelor's or Master's)

Tools

HP RMB / SPECS

Splus / R

Python

MATLAB

UNIX

Cadence Virtuoso

HP IC-CAP

Agilent B1500

Job description

Renesas in Morrisville, NC, is seeking a Senior Staff Device Characterization Engineer to lead cutting-edge power device development. You will be responsible for wafer- and package-level measurements, I-V curves, and reliability tests, working on-site with the TD team.

You will operate HP and Agilent equipment, develop software for device modeling, and collaborate with teammates to debug test chips while upgrading hardware and software as testing needs evolve.