Senior Design Engineer, HBM

Micron Technology; Richardson (TX); On-site; USD 140,000 - 170,000; Full time

Benefits offered by this job

Medical/Dental/Vision

Paid time off

Paid holidays

401(k) plan

Job summary

Micron Technology in Richardson, TX is seeking a Sr Design Engineer to design, simulate, and validate next‑generation High‑Bandwidth Memory (HBM) architectures and DRAM blocks. You will collaborate with global design teams to optimize timing, power, and reliability for AI/ML, HPC, and graphics applications.

You will participate in tape‑out activities, ECOs, and verification using industry tools, ensuring manufacturability and quality across complex 3D-stacked memory systems.

Qualifications

• MS in Computer Engineering or related field.
• 3 years DRAM Design or Verification experience.
• Prior experience in HBM, DRAM, high-speed I/O, or memory-related designs.
• Familiar with device reliability and verification flows.
• Experience in function verification and timing analysis with mixed signal design.

Responsibilities

• Design, optimize, and validate memory blocks and post-silicon bring-up.
• Collaborate with layout engineers on floorplanning, placement, routing, and constraints.
• Review parasitics, EM/IR, and reliability results; drive fixes as needed.
• Ensure designs are manufacturable and meet foundry and packaging requirements.
• Support tape-out activities, ECOs, and reticle experiments as required.
• Participate in functional, timing, and power verification using standard simulation tools.

Skills

HBM design

DRAM design

High-speed I/O

PHY timing

Power integrity

3D stacked architectures

TSV signaling

Education

MS in Computer Engineering

Tools

HSPICE

VerilogHDL

Primesim

Job description

Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Sr Design Engineer, you will work on design, simulation, and validation of next‑generation High‑Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co‑optimization with GPUs/accelerators.

This role sits at the intersection of DRAM design and high‑performance computing, enabling future AI/ML, HPC, and advanced graphics products.

In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time‑to‑market, and customer satisfaction.

Responsibilities Will Include, But Are Not Limited To

• Design, optimize, and valSupport post‑silicon bring‑up, failure analysis, and design correlation when required
• Work closely with layout engineers on floorplanning, placement, routing, and design rule compliance
• Review parasitics, EM/IR, and reliability results; drive design or layout fixes as needed
• Ensure designs are manufacturable and meet foundry and packaging
• Minimum Qualifications:
• Prior experience in HBM, DRAM, high‑speed I/O, or memory‑related designs
• Familiarity wiconstraints
• Apply AI/ML-
• nabled tools that enhance productivity, design quality, verification coverage, and time‑to‑market
• th 3D‑stacked architectures, TSVs, wide I/O interfaces, or PHY‑adjacent logic
• Understanding of DRAM array control and high speed circuit design
• Experience in function verification and timing analysis with mixed signal design.
• Familiar with device reliability. Experienced in reliability mitigation technology and verification flow.
• Familiar with analog/digital simulation tools, i.e., HSPICE, VerilogHDL, Primesim’
• MS in Computer Engineering or related field
• 3 years DRAM Design or Verification experience.
• Excellent Problem‑Solving & Analytical Skills
• idate memory, logic, analog, or mixed‑signal circuits used in HBM products, including PHY‑adjacent or subsystem logic
• Contribute to HBM architecture definition, block‑level specifications, and design tradeoff analysis across performance, power, area, and reliability
• Perform pre‑layout and post‑layout simulation, modeling, and analysis to ensure robust design margins
• Support tape‑out activities, ECOs, and reticle experiments as required
• Participate in functional, timing, and power verification using industry‑standard simulation tools
• Collaborate closely with Design Verification teams to review test plans, debug failures, and close coverage gaps

(LLM)

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

please visit micron.com/careers

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