Semiconductor Mechanical Design Intern

KLA

Ann Arbor (MI)

On-site

USD 37,195,000 - 53,038,000

Full time

10 days ago

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Benefits offered by this job

Tuition reimbursement
Student debt assistance
401(k) matching

Job summary

KLA in Ann Arbor, Michigan invites motivated students to join our internship program, helping develop sub‑assemblies for industry‑leading inspection and metrology tools. This role offers hands‑on experience in semiconductor equipment and a path to expand technical skills within a fast‑paced, innovative culture.

You will design 3D CAD models, create engineering documentation, and collaborate with cross‑functional teams across electrical, optical, systems and software disciplines while gaining

Qualifications

  • Completed fundamental coursework in mechanical design and manufacturing.
  • Familiarity with CAD software is a strong plus.
  • Strong analytical and problem‑solving skills are required.
  • Excellent written and verbal communication, and collaborative mindset.

Responsibilities

  • Design 3D CAD models of mechanical parts and assemblies.
  • Create and maintain engineering documentation.
  • Perform basic analytical modeling to support design decisions.
  • Collaborate with cross‑disciplinary teams (electrical, optical, systems, software).
  • Procure components and materials for prototyping.
  • Assemble and test designs in a laboratory setting.

Skills

Strong analytical
Excellent written and verbal comms
Interpersonal skills
Collaborative mindset
Proactive attitude
Cross-functional teamwork

Education

Mechanical design coursework

Tools

PTC Creo
Ansys

Job description

KLA in Ann Arbor, Michigan invites motivated students to join our internship program, helping develop sub‑assemblies for industry‑leading inspection and metrology tools. This role offers hands‑on experience in semiconductor equipment and a path to expand technical skills within a fast‑paced, innovative culture.

You will design 3D CAD models, create engineering documentation, and collaborate with cross‑functional teams across electrical, optical, systems and software disciplines while gaining

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