[Samsung Electronics America] CVD Process Engineering Manager 채용

Samsung Electronics America; United States; On-site; USD 147,000 - 201,000; Full time

Benefits offered by this job

Medical Insurance

Dental Insurance

Vision Insurance

Life Insurance

401(k) Matching

Onsite Café

PTO

Personal Holidays

Job summary

Samsung Austin Semiconductor in Taylor, TX is seeking a process engineering manager to head the CVD/Thin Films process engineering sub team. The role requires a technical leader who can translate site objectives into actionable roadmaps while maintaining a strong safety and quality mindset.

You will mentor TRs, drive cross-functional collaboration with Equipment Engineering and Process Operations, and govern 8D, ALPS, PCCB frameworks to ensure reliable 2nm readiness and efficient tool

Qualifications

• Deep expertise in 2nm semiconductor process engineering and integration.
• Proven leadership of multi-tier engineering teams in high-volume manufacturing.
• Expert-level knowledge of eSPEC, PEMS, APC, RMS and YMS.
• Mastery of 8D, ALPS, PCCB, TMCB and RACB process frameworks.
• Strong ability to communicate technical risks to executives.

Responsibilities

• Translate site objectives into an actionable roadmap for Process TRs.
• Allocate manpower and technical resources to meet key deliverables.
• Foster cross-functional collaboration between Process Eng, Equipment Eng, and Process Operations.
• Establish standardized protocols for 8D, ALPS and PCCB processes.
• Coach TRs on performance management and talent development.
• Oversee annual performance cycles for the process organization.
• Maintain a learning-first, high-performance culture across both pods.
• Escalate and resolve technical or interpersonal disputes.
• Provide executive guidance on 2nm semiconductor processes and integration.
• Oversee risk management, abnormalities, and deviations for quality vs production.
• Ensure optimal use of Process systems (eSPEC, PEMS, APC, RMS, YMS) and adopt new tools.
• Ensure site safety and Loss Safety Management goals.
• Oversee mass production readiness for 2nm tool qualifications.
• Drive CIP across operations interlocks and processes.
• Synthesize TR data into concise site leadership reports.

Skills

2nm process engineering

Leadership of managers

eSPEC / PEMS / APC / RMS / YMS

8D / ALPS / PCCB / TMCB / RACB

Executive communication

Tools

eSPEC

PEMS

APC

RMS

YMS

Job description

About Samsung Austin SemiconductorSamsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.

About Samsung Austin Semiconductor
Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At Samsung Austin Semiconductor, we are Innovating Today to Power the Devices of Tomorrow.

Come innovate with us!

Position Summary

The Chemical Vapor Deposition (CVD) / Thin Films department at the Samsung semiconductor fabrication facility in Taylor, TX is looking for a process engineering manager to head the process engineering sub team. Candidates should be highly motivated, self-directed, technically proficient, and have a strong safety & quality mindset.

Role and Responsibilities

Here’s What You'll Be Responsible For:

• Strategic Translation: Convert high-level site and departmental objectives into a cohesive operational roadmap for Process TRs to execute.
• Resource Optimization: Manage the allocation of manpower and technical resources across your teams to ensure key deliverables are met.
• Cross-Functional Synergy: Drive high-level collaboration between Process Engineering, Equipment Engineering, and Process Operations to eliminate bottlenecks and reduce tool downtime.
• Governance: Establish and maintain standardized protocols for 8D, ALPS, and PCCB processes to ensure consistency across all process pods.

Management of Leaders:

• Leadership Coaching: Mentor Process TRs on how to effectively manage their individual contributors, focusing on goal setting, talent development, and performance management.
• Performance Architecture: Oversee the annual performance management cycle for the entire process organization, ensuring fair and rigorous evaluation standards are applied by the TRs.
• Culture Stewardship: Foster a \"learning-first,\" high-performance culture across both teams, ensuring that knowledge is shared between the two pods to prevent single-point-of-failure risks.
• Conflict Resolution: Act as the final escalation point for technical or interpersonal disputes within the process teams.

Technical Governance & Risk Management :

• High-Level Technical Oversight: Provide executive-level guidance on semiconductor processes and integration for 2nm, ensuring technical decisions are sound and sustainable.
• Risk Mitigation: Oversee the management of abnormalities and deviations; ensure that the TRs are balancing quality guarantees with production and cost objectives.
• Systems Stewardship: Ensure the optimal utilization of Process systems (eSPEC, PEMS, APC, RMS, YMS) and drive the adoption of new tool-set capabilities.
• Safety & Compliance: Hold TRs accountable for strict adherence to site-wide safety standards and the achievement of LSM (Loss Safety Management) goals.

Operational Excellence & Site Readiness:

• Mass Production Readiness: Oversee the timeline for new tool process qualification, ensuring that both teams are hitting milestones required for 2nm readiness.
• CIP Strategy: Drive the overarching Continuous Improvement Process (CIP) for Operations interlocks, holds, and patient lot processes.
• Executive Communication: Synthesize complex technical data from the TRs into concise reports and presentations for site leadership.

Skills and Qualifications

Here’s what you'll need:

• Technical Expertise: Deep expertise in 2nm semiconductor process engineering and integration.
• Leadership Experience: Proven experience managing other managers or leading large, multi-tiered engineering teams in a high-volume manufacturing (HVM) environment.
• Systems Knowledge: Expert-level understanding of eSPEC, PEMS, APC, RMS, and YMS.
• Methodology: Mastery of 8D, ALPS, PCCB, TMCB, and RACB process frameworks.
• Communication: Ability to navigate complex organizational hierarchies and communicate technical risks to non-technical executives.

The current base salary range for this role is between $147,000 - $200,500. Individual base pay rates will depend on factors including duties, work location, education, skills, qualifications and experience. Total compensation for this position will include a competitive benefits package and may include participation in company incentive compensation programs, which are based on factors to include organizational and individual performance

Total Rewards

At Samsung Austin Semiconductor, base pay is just one part of our total compensation package. The base compensation for this role will depend on education, experience, skills, and location.

We offer a comprehensive benefits package, including:

• Medical, dental, and vision insurance
• Life insurance and 401(k) matching with immediate vesting
• Onsite café(s) and workout facilities
• Paid maternity and paternity leave
• Paid time off (PTO) + 2 personal holidays and 10 regular holidays
• Wellness incentives and MORE
  

Eligible full-time employees (salaried or hourly) may also receive MBO bonuses based on company, division, and individual performance.

All positions at Samsung Austin Semiconductor are full-time on-site.

U.S. Export Control

This role may require access to information subject to U.S. export control laws. Applicants must be authorized to access such information or eligible for government authorization.

Trade Secrets

By submitting an application, you agree not to disclose to Samsung or induce or encourage Samsung to use any confidential or proprietary information (including trade secrets) belonging to a current or former employer or other entity.