Remote CMC Mechanical Analysis Lead Engineer

GE Aerospace; San Ramon (CA); Remote; USD 95,000 - 159,000; Full time

Benefits offered by this job

Health benefits

401(k) with company match

Tuition assistance

Parental leave

Disability insurance

Job summary

GE Aerospace is seeking a Lead Engineer for the Ceramic Matrix Composite (CMC) Commercial Mechanical Analysis team. You will lead mechanical analyses and life analyses of CMC hot-section hardware in GE9X and support fielded engines, with emphasis on manufacturing support (MRB) and durability.

You will perform FEA using ANSYS and preprocessors such as Hypermesh/NX, collaborate across hardware owners, thermal and material teams, and mentor junior engineers.

Qualifications

• BS degree in engineering or equivalent with 3+ years in ceramics or manufacturing
• Experience in Ceramic Matrix Composites is required
• Strong documentation and communication skills

Responsibilities

• Execute analyses per project requirements
• Develop conceptual turbofan hot-section knowledge
• Apply mechanical engineering and analysis concepts
• Resolve issues with mentor guidance
• Collaborate with cross-functional teams
• Communicate results to leaders
• Document assumptions and results
• Coach junior team members
• Create macros/tools to standardize stress analysis for CMCs

Skills

Attention to detail

Leadership

Project management

Problem solving

Willingness to learn

Oral and written communication

Team collaboration

Education

Bachelor's degree in Engineering

High school diploma + 4 years design engineering experience

Tools

ANSYS

Hypermesh

NX

CMC mechanical analysis tools

Job description

GE Aerospace is seeking a Lead Engineer for the Ceramic Matrix Composite (CMC) Commercial Mechanical Analysis team. You will lead mechanical analyses and life analyses of CMC hot-section hardware in GE9X and support fielded engines, with emphasis on manufacturing support (MRB) and durability.

You will perform FEA using ANSYS and preprocessors such as Hypermesh/NX, collaborate across hardware owners, thermal and material teams, and mentor junior engineers.