R&D Engineering, Staff Engineer

Synopsys Inc; Austin (TX); On-site; USD 120,000 - 150,000; Full time

Job summary

Synopsys Inc. is seeking a technically deep specialist to support RedHawk-SC Electrothermal solutions across thermal, power integrity, EM/IR, and advanced packaging workflows. You will analyze designs, reproduce issues, isolate root causes, and provide practical solutions with clear evidence to R&D.

The role emphasizes customer engagement and strong domain knowledge in multiphysics simulation. You will craft use cases, validate features against real scenarios, and deliver guidance through notes,

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Physics, or related field with at least 5 years of related experience, or Master's degree with at least 3 years of experience.
• Comprehensive technical knowledge in semiconductor EDA, thermal analysis, electrothermal simulation, power integrity, EM/IR, reliability, signal integrity, mechanical stress, package analysis, or multiphysics simulation.
• Experience applying engineering judgment to solve diverse technical problems and independently delivering defined technical projects from start to finish.
• Ability to analyze simulation results, identify root causes, and communicate findings and recommendations clearly to technical and non-technical audiences.
• Strong written, verbal, and presentation skills, with demonstrated ability to interact effectively with customers and cross-functional teams.
• Experience with RedHawk-SC, RedHawk-SC Electrothermal, Totem, PrimePower, PrimeTime, Fusion Compiler, 3DIC Compiler, or comparable EDA and multiphysics tools is a strong plus.
• Experience with 2.5D/3DIC, chiplets, HBM, interposers, package/board modeling, co-packaged optics, or heterogeneous integration is a plus.

Responsibilities

• Support customer evaluations, pilots, and production deployments of RedHawk-SC Electrothermal technologies across thermal, power integrity, EM/IR, and advanced packaging workflows
• Analyze customer designs and workflows, reproduce technical issues, isolate root causes, and deliver practical solutions or elevate it with test cases and clear technical evidence to R&D
• Gather field and customer requirements and translate them into clear use cases, functional requirements, and validation criteria that Product Management and R&D can act on
• Validate new features and capabilities against real customer scenarios, document results and limitations, and provide structured feedback on product readiness, quality, and usability
• Develop application notes, best-practice guides, training materials, and reusable deployment collateral for thermal, electrothermal, stress, and chip-package-system workflows
• Conduct technical reviews, demonstrations, workshops, and training sessions for customers, field teams, and application engineers
• Partner with Application Engineering to deliver technically accurate and timely responses to customer escalations and deployment challenges

Skills

Strong communication

Presentation skills

Analytical thinking

Customer interaction

Cross-functional collaboration

Problem solving

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Physics, or related field

Master's degree with at least 3 years experience

Tools

RedHawk-SC

RedHawk-SC Electrothermal

Totem

PrimePower

PrimeTime

Fusion Compiler

3DIC Compiler

Job description

We Are

Synopsys is the leader in engineering solutions from silicon to systems, enabling customers to rapidly innovate AI-powered products. We deliver industry-leading silicon design, IP, simulation and analysis solutions, and design services. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow.

You Are

You have spent years working at the boundary between complex simulation technology and the engineers who depend on it to sign off chips that actually work in production. You understand that thermal hotspots, voltage drop, and electromigration are not just simulation outputs, they are design risks that can kill a tapeout or a product launch, and you know how to help customers see the difference between a tool running and a methodology that delivers answers they can trust.

You are comfortable jumping into a customer's design environment, reproducing an issue, isolating what matters, and explaining what you found without jargon or deflection. You do not need perfect information to move forward. You ask the right questions, figure out what the actual problem is, and either solve it or elevate it with enough clarity that R&D can act.

You have worked with real chips, real packages, or real multiphysics workflows, whether in design, analysis, or deployment, and you bring a point of view on what good looks like. You can sit with a customer's engineering team and earn credibility in the first thirty minutes because you understand their constraints, their tools, and their timeline.

At Synopsys, you will work on multiphysics signoff solutions that matter to the most advanced semiconductor designs being built today, and the customers you support will know the difference you made.

What You’ll Be Doing

• Support customer evaluations, pilots, and production deployments of RedHawk-SC Electrothermal technologies across thermal, power integrity, EM/IR, and advanced packaging workflows
• Analyze customer designs and workflows, reproduce technical issues, isolate root causes, and deliver practical solutions or elevate it with test cases and clear technical evidence to R&D
• Gather field and customer requirements and translate them into clear use cases, functional requirements, and validation criteria that Product Management and R&D can act on
• Validate new features and capabilities against real customer scenarios, document results and limitations, and provide structured feedback on product readiness, quality, and usability
• Develop application notes, best-practice guides, training materials, and reusable deployment collateral for thermal, electrothermal, stress, and chip-package-system workflows
• Conduct technical reviews, demonstrations, workshops, and training sessions for customers, field teams, and application engineers
• Partner with Application Engineering to deliver technically accurate and timely responses to customer escalations and deployment challenges

The Impact You Will Have

• Customer deployments move faster and with fewer escalations because you provided the right technical guidance at the right time
• Product capabilities ship with credible validation evidence and documented workflows that field teams and customers can actually use
• R&D receives actionable feedback supported by reproducible test cases, which means faster resolution and better product quality
• Customers trust the methodology because you helped them understand not just how to run the tool, but how to interpret results and make decisions
• Field teams become more effective in your domain because you shared what you learned and built reusable collateral that scales
• Advanced packaging, 3DIC, and multiphysics workflows become repeatable and production-ready because you defined what good looks like
• Your technical ownership in at least one RHSC-ET domain becomes a reference point for the broader team and ecosystem

What You’ll Need

• Bachelor's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Physics, or related field with at least 5 years of related experience, or Master's degree with at least 3 years of experience
• Comprehensive technical knowledge in semiconductor EDA, thermal analysis, electrothermal simulation, power integrity, EM/IR, reliability, signal integrity, mechanical stress, package analysis, or multiphysics simulation
• Experience applying engineering judgment to solve diverse technical problems and independently delivering defined technical projects from start to finish
• Ability to analyze simulation results, identify root causes, and communicate findings and recommendations clearly to technical and non-technical audiences
• Strong written, verbal, and presentation skills, with demonstrated ability to interact effectively with customers and cross-functional teams
• Experience with RedHawk-SC, RedHawk-SC Electrothermal, Totem, PrimePower, PrimeTime, Fusion Compiler, 3DIC Compiler, or comparable EDA and multiphysics tools is a strong plus
• Experience with 2.5D/3DIC, chiplets, HBM, interposers, package/board modeling, co-packaged optics, or heterogeneous integration is a plus

Who You Are

• You can walk into a customer meeting, listen to a technical problem, and within an hour have a plan for what to test, what to rule out, and what to elevate
• You explain complex tradeoffs and analysis results in ways that make sense to the person who has to make the decision, whether that is a design engineer, a manager, or a VP
• You do not wait for someone to tell you what to do next. You see what is blocking progress, figure out who needs to be involved, and drive it forward
• You know when to dig deeper and when to elevate, and when you elevate, you bring enough context and evidence that the next person can act immediately
• You are comfortable saying "I do not know yet, but here is how I will find out" and then actually following through
• You treat customer issues and product quality as your problem to solve, not someone else's responsibility

The Team You’ll Be Part Of

Your recruiter will share more about the team structure and mission during the interview process.

Rewards and Benefits

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.