Product Yield Enhancement Development Failure Analysis Engineer (High Bandwidth Memory)

micron; Boise (ID); On-site; USD 100,000 - 140,000; Full time

Benefits offered by this job

Paid time off

Paid holidays

Benefits coverage

Job summary

Micron Boise is recruiting a Level 2/3 HBM PDFA Engineer to advance next-generation HBM devices from design through qualification and into high-volume production. You will perform electrical, physical, and statistical failure analyses, analyze data, and apply AI-enabled tools to drive yield improvements and reliability.

Collaboration with multi-functional teams is essential, with opportunities to influence product ramp and qualification timelines.

Qualifications

• Bachelor's degree in Electrical/Computer Engineering or related field.
• 2+ years in electrical and statistical failure analysis.
• Experience with semiconductor failure analysis techniques.
• Proficient in data analytics and statistical methods.
• Experience using AI/ML tools for engineering analysis.
• Coursework in VLSI, device physics, Python, and statistics.
• Strong communication and teamwork skills.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify defects and failure mechanisms in HBM products.
• Analyze data to resolve root causes using statistical methods and AI-enabled tools.
• Apply AI tools (Copilot, Claude) to improve failure detection and reliability.
• Collaborate with Product, Process, Test, Quality, and Manufacturing teams to resolve issues.
• Identify process and assembly defects through detailed data analysis.
• Communicate findings and corrective actions to teams and drive resolution.
• Support rapid production ramp, qualification, and reliability improvement initiatives.

Skills

HBM PDFA

Electrical engineering

Statistical analysis

Python

AI tools

Education

Bachelor's degree in Electrical/Computer Engineering

Tools

Copilot

Claude

JMP

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron in Boise, Idaho has a current need for a Level 2 or 3 HBM (High Bandwidth Memory) Product Yield Enhancement PDFA Engineer position open where you will work on the Product Development Failure Analysis team to take next generation HBM devices from design to mass production!

As part of the HBM Product Development Failure Analysis (PDFA) team, you will play a meaningful role in bringing next-generation HBM products from design through qualification and into high production manufacturing. The team focuses on ensuring product reliability, accelerating time-to-market, and enabling rapid production ramp by identifying and resolving component-level failures during new product introduction phases.

In this role, you will apply electrical, physical, and statistical failure analysis techniques to characterize failures, identify root causes, and drive corrective actions. You will collaborate with multi-functional engineering teams and leverage advanced analytics, statistical methods, and AI-enabled tools to improve failure detection, yield, reliability, and overall product performance.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify, characterize, and understand defect and failure mechanisms in HBM products.
• Analyze component- and system-level data to resolve root causes of failures using statistical techniques, engineering methodologies, and AI-enabled tools.
• Apply AI tools (e.g., Copilot, Claude) and improved analytics to enhance failure detection, reliability learning cycles, yield improvement, and component performance.
• Work closely with Product, Process, Test, Quality, and Manufacturing Engineering teams to resolve fabrication, assembly, and test-related issues.
• Identify process defects, assembly-related failures, and test flow marginalities through detailed data analysis and characterization.
• Communicate technical findings, recommendations, and corrective actions to team members and drive issue resolution across multi-functional teams.
• Support rapid production ramp, product qualification, and continuous reliability improvement initiatives.

Minimum Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
• 2+ years of experience performing electrical and statistical failure analysis to identify and understand failure mechanisms.
• 2+ years of experience applying electrical and physical characterization techniques for semiconductor failure analysis.
• Demonstrated analytical and problem-solving skills, including the application of statistical methods and tools for data analysis.
• Experience using AI, machine learning, or data analytics tools to support engineering analysis and root cause investigations.
• Coursework, training, or practical experience in one or more of the following areas: VLSI, semiconductor device physics, semiconductor processing, Python programming, and statistics.
• Strong written and verbal communication skills with the ability to collaborate effectively in multi-functional engineering teams.

Preferred Qualifications

• 5+ years of experience performing electrical and statistical failure analysis in the semiconductor industry.
• 5+ years of experience applying electrical and physical characterization techniques for semiconductor device and component analysis.
• Advanced coursework or hands-on experience in VLSI design, semiconductor processes, device physics, Python, and applied statistics.
• Experience using Artificial Intelligence or Generative AI tools (e.g., Copilot, Claude) for large-scale data analysis, failure prediction, and root cause identification.
• Experience using statistical analysis software such as JMP.
• Confirmed ability to influence technical outcomes and drive issue resolution in a multidisciplinary engineering environment.
• Proven ability to communicate complex technical findings to diverse team members and lead multi-functional collaboration efforts.

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.