Product Engineer – Yield & Quality for Next‑Gen Chips
TSMC - Taiwan Semiconductor Manufacturing Company Limited
Phoenix (AZ)
On-site
USD 80,000 - 120,000
Full time
14 days+
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Job summary
A leading semiconductor manufacturer in Phoenix, Arizona, is seeking a Product Design Engineer to lead efforts in enhancing chip yield performance. Candidates should have a Master’s Degree in Electrical Engineering and be able to analyze complex semiconductor issues. Responsibilities include identifying root causes of performance issues, performing failure analysis, and supporting the design process. Key qualifications include strong problem-solving and communication skills, along with a capability to work on cross-functional teams.
Qualifications
Legally eligible to work in the United States.
Ability to travel and train in Taiwan for 6 – 9 months.
Working knowledge of semiconductor physics and CMOS device operation is preferred.
Familiar with digital circuit design is preferred.
Able to work within cross-functional teams.
Responsibilities
Lead team to identify root cause for N5/N4 chip performance issues.
Analyze CP test bin data to identify failure mode.
Perform electrical and physical failure analysis.
Work to define corrective actions with integration and process teams.
Support product early-stage design for smooth tape-out.
Skills
Problem-solving skills
Communication abilities
Ability to work under pressure
Active learning
Education
Master’s Degree in Electrical Engineering
Job description
A leading semiconductor manufacturer in Phoenix, Arizona, is seeking a Product Design Engineer to lead efforts in enhancing chip yield performance. Candidates should have a Master’s Degree in Electrical Engineering and be able to analyze complex semiconductor issues. Responsibilities include identifying root causes of performance issues, performing failure analysis, and supporting the design process. Key qualifications include strong problem-solving and communication skills, along with a capability to work on cross-functional teams.